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Solder Mask. PSR-4000MP Datasheet

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Solder Mask. PSR-4000MP Datasheet






PSR-4000MP Mask. Datasheet pdf. Equivalent




PSR-4000MP Mask. Datasheet pdf. Equivalent





Part

PSR-4000MP

Description

Liquid Photoimageable Solder Mask

Manufacture

Taiyo

Datasheet
Download PSR-4000MP Datasheet


Taiyo PSR-4000MP

PSR-4000MP; www.DataSheet4U.com TAIYO PSR-4000MP LI QUID PHOTOIMAGEABLE SOLDER MASK Screen or Spray Application Dark Green, Matte Finish Excellent Solder Ball Resistance Resistance to No-Clean Flux Residue Wi de Processing Window Fine Dam Resolutio n Withstands ENIG & Immersion Tin Hard Surface Finish Low Odor Revised 06-19- 03 www.DataSheet4U.com PROCESSING PAR AMETERS FOR PSR-40.


Taiyo PSR-4000MP

00MP PSR-4000MP is a two-component, matt e dark Green, alkaline developable LPI solder mask product for flood screen an d spray application methods. This produ ct has a very low odor, a wide process window and is capable of withstanding a lternate metal finishes such as ENIG an d immersion Tin. It has a matte Dark Gr een finish and provides excellent solde r ball resistance .


Taiyo PSR-4000MP

in no clean flux assembly applications. PSR-4000MP meets or exceeds the require ments of IPC SM-840C Class H and Class T, Bellcore GR-78-CORE Issue 1, and has a UL flammability rating of 94V-0. PS R-4000MP C OMPONENTS PSR-4000MP / CA-4 0MP Mixing Ratio 100 parts 25 parts Col or Green White Mixed Properties Solids 80% Viscosity 140 – 180 ps Specific G ravity 1.58 MIXING .



Part

PSR-4000MP

Description

Liquid Photoimageable Solder Mask

Manufacture

Taiyo

Datasheet
Download PSR-4000MP Datasheet




 PSR-4000MP
www.DataSheet4U.com
TAIYO PSR-4000MP
LIQUID PHOTOIMAGEABLE SOLDER MASK
Screen or Spray Application
Dark Green, Matte Finish
Excellent Solder Ball Resistance
Resistance to No-Clean Flux Residue
Wide Processing Window
Fine Dam Resolution
Withstands ENIG & Immersion Tin
Hard Surface Finish
Low Odor
Revised 06-19-03





 PSR-4000MP
www.DataSheet4U.com
PROCESSING PARAMETERS FOR PSR-4000MP
PSR-4000MP is a two-component, matte dark Green, alkaline developable LPI solder
mask product for flood screen and spray application methods. This product has a very
low odor, a wide process window and is capable of withstanding alternate metal finishes
such as ENIG and immersion Tin. It has a matte Dark Green finish and provides
excellent solder ball resistance in no clean flux assembly applications. PSR-4000MP
meets or exceeds the requirements of IPC SM-840C Class H and Class T, Bellcore
GR-78-CORE Issue 1, and has a UL flammability rating of 94V-0.
PSR-4000MP COMPONENTS
PSR-4000MP / CA-40MP
Mixing Ratio
100 parts 25 parts
Color
Green
Mixed Properties
White
Solids
80%
Viscosity
140 – 180 ps
Specific Gravity
1.58
MIXING
PSR-4000MP is supplied in pre-measured containers with a mix
ratio by weight of 100 parts PSR-4000MP and 25 parts CA-40MP.
PSR-4000MP can be mixed by hand with a mixing spatula for 10 –
15 minutes. Mixing can be done with a mechanical mixer at low
speeds to minimize shear thinning for 10 – 15 minutes. Also,
mixing can be done with a paint shaker for 10 – 15 minutes.
PRE-CLEANING
Prior to solder mask application, the printed circuit board surface
needs to be cleaned. Various cleaning methods include Pumice,
Aluminum Oxide, Mechanical Brush, and Chemical Clean. All of
these methods will provide a clean surface for the application of
PSR-4000MP. Hold time after cleaning the printed circuit board
should be held to a minimum to reduce the oxidation of the copper
surfaces.
Revised 06-19-03





 PSR-4000MP
www.DataSheet4U.com
PROCESSING PARAMETERS FOR PSR-4000MP
SCREEN PRINTING
Method: Single Sided and Double Sided Screening
Screen Mesh: 86 – 110
Screen Mesh Angle: 22.5° Bias
Screen Tension: 20 - 28 Newtons
Squeegee: 60 – 80 durometer
Squeegee Angle: 27 – 35°
Printing Mode: Flood / Print / Print
Flood Pressure: 20 – 30 psi
Printing Speed: 2.0 – 9.9 inches/sec
Printing Pressure: 60 – 100 psi
TACK DRY CYCLE
The Tack Dry step is required to remove solvent from the solder
mask film and produce a firm dry surface. The optimum dwell time
and oven temperature will depend on oven type, oven loading, air
circulation, exhaust rate, and ramp times. Excessive tack dry times
and temperature will result in difficulty developing solder mask from
through holes and a reduction in photo speed. Insufficient tack dry
will result in artwork marking and/or sticking. Typical tack dry
conditions for PSR-4000MP are as followed:
Oven Temperature: 150 - 185°F (65 - 85°C)
For Single-Sided (Batch Oven)
1st Side: Dwell Time: 10 - 20 minutes
2nd Side: Dwell Time: 25 - 45 minutes
For Double -Sided (Conveyorized or Batch Oven)
§ Dwell Time: 25 - 60 minutes
EXPOSURE
PSR-4000MP requires UV exposure to define solder mask dams
and features. The spectral sensitivity of PSR-4000MP is in the
area of 365 nm. Exposure times will vary by bulb type and age of
the bulb. Below are guidelines for exposing PSR-4000MP.
Exposure Unit: 5 kW or higher
Stouffer Step 21: Clear 8 minimum (on metal / under
phototool)
Energy: 250 mJ / cm2 minimum (under phototool)
Revised 06-19-03



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