Document
SEMiX 302KD ... THYRISTOR BRIDGE,SCR,BRIDGE
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Conditions
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Preliminary Data
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Features
Typical Applications
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21-06-2007 SCH
© by SEMIKRON
RECTIFIER,DIODE,THYRISTOR,MODULE
Fig. 1L Power dissipation per diode vs. forward current www.DataSheet4U.com
Fig. 1R Power dissipation per diode vs. ambient temperature
Fig. 3L Power dissipation of two modules vs. direct current
Fig. 3R Power dissipation of two modules vs. case temperature
Fig. 4L Power dissipation of three modules vs. direct current
Fig. 4R Power dissipation of three modules vs. case temperature
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21-06-2007 SCH
© by SEMIKRON
SEMiX 302KD ... THYRISTOR BRIDGE,SCR,BRIDGE
Fig. 6 Transient thermal impedance vs. time www.DataSheet4U.com
Fig. 7 Forward characteristics
Fig. 8 Surge overload current vs. time
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21-06-2007 SCH
© by SEMIKRON
RECTIFIER,DIODE,THYRISTOR,MODULE
Dimensions in mm
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www.DataSheet4U.com
$5% 67
This technical information specifies semiconductor devices but promises no characteristics. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability.
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21-06-2007 SCH
© by SEMIKRON
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