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NCV7729 Dataheets PDF



Part Number NCV7729
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description 8A H-Bridge Driver
Datasheet NCV7729 DatasheetNCV7729 Datasheet (PDF)

NCV7729 8 A H-Bridge Driver The NCV7729 is an intelligent, fully protected H−Bridge Driver designed specifically for control of DC and stepper motors in safety critical applications under automotive/industrial environment. Features • Operating VS Battery Supply Voltage 5 V to 28 V • Operating VCC Supply Voltage 3.0 to 5.5 V • 18 V Survivability on VCC and All Logic I/O Pins • Typical RDS(on) = 150 mW, RDS(MAX) = 300 mW (150°C) • Continuous DC Load Current 5A (TC < 100°C) • Selectable Output Cur.

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NCV7729 8 A H-Bridge Driver The NCV7729 is an intelligent, fully protected H−Bridge Driver designed specifically for control of DC and stepper motors in safety critical applications under automotive/industrial environment. Features • Operating VS Battery Supply Voltage 5 V to 28 V • Operating VCC Supply Voltage 3.0 to 5.5 V • 18 V Survivability on VCC and All Logic I/O Pins • Typical RDS(on) = 150 mW, RDS(MAX) = 300 mW (150°C) • Continuous DC Load Current 5A (TC < 100°C) • Selectable Output Current Limitation (2.5 A to 9.6 A) • Output Switching Frequency Up to 30 kHz • Monitoring of All Supply Voltages, Safe Power−up State • Loss of GND Detection • Short−Circuit Protection and Thermal Shutdown • Full Diagnosis Capability for Open Load, Short to GND/VS and Shorted Load Conditions • SPI Interface for Configuration and Diagnosis • Undervoltage Lockout • Regulated Charge Pump for Optimized EMI Behavior • NCV Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • This is a Pb−Free Device Typical Applications • Automotive ♦ Electronic Throttle Control (ETC) ♦ Variable Intake Geometry ♦ Exhaust Gas Recirculation ♦ Variable Swirl ♦ Blow−off Flap • Industrial http://onsemi.com PSOP−20 CASE 525AB MARKING DIAGRAM 20 11 NCV7729BG AWLYYWWG 1 10 A = Assembly Location WL = Wafer Lot YY = Year WW = Work Week G = Pb−Free Package ORDERING INFORMATION Device Package Shipping† NCV7729BPPR2G PSOP−20 (Pb−Free) 750 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. © Semiconductor Components Industries, LLC, 2014 1 August, 2014 − Rev. 2 Publication Order Number: NCV7729/D VCC 12 NCV7729 CHP 4 Core Functions Biasing and Supply Regulated Chargepump VS 5,16 IN1 3 IN2 19 EN 13 DIS/SF 18 CSB 17 SCLK 2 SI 9 SO 8 16bit SPI−I/F Control Logic Driver & Gate Control 6,7 14,15 OUT1 OUT2 GND Loss Detection 1 20 AGND DGND Output Protection and Diagnostics 10,11 GND Figure 1. Block Diagram http://onsemi.com 2 SUPERVISOR mC MAIN mC REG1 5V / 3.3V REG2 5V / 3.3V NCV7729 REVERSE BATTERY & TRANSIENT PROTECTION VBAT VBAT VCC 12 CHP 4 Core Functions Biasing and Supply Regulated Chargepump CBUF 22 nF 100mF 100nF VS 5,16 16bit SPI−I/F Control Logic Ddriver & Gate Control IN1 3 IN2 19 EN 13 DIS/SF 18 CSB 17 SCLK 2 SI 9 SO 8 GND Loss Detection 1 20 AGND DGND 6,7 14,15 OUT1 OUT2 M Output Protection and Diagnostics 10,11 GND Figure 2. ETC Application Diagram http://onsemi.com 3 NCV7729 PACKAGE PIN DESCRIPTION Pin# Symbol Description 1 AGND Analog Ground; Device Substrate. 2 SCLK Serial Clock. Clock input for SPI communication (internal pullup to VCC) 3 IN1 Control Input 1 (internal pullup to VCC) 4 CHP Charge pump in/output 5 VS Supply voltage; must be connected to pin 16 externally 6 OUT1 Output1; must be connected to pin 7 externally 7 OUT1 Output1; must be connected to pin 6 externally 8 SO Serial Output. 16 bit SPI communications output. 9 SI Serial Input. 16 bit SPI communications input (internal pullup to VCC) 10 GND Power Ground. 11 GND Power Ground. 12 VCC Power supply for logic 13 EN Enable input (internal pulldown to AGND) 14 OUT2 Output2; connect to pin 15 externally 15 OUT2 Output2; connect to pin 14 externally 16 VS Supply voltage; must be connected to pin 5 externally 17 CSB Chip Select Bar Input. Active low SPI port operation (internal pullup to VCC) 18 DIS/SF Disable Input / Status Flag Output (Open drain w/ internal pullup to VCC) 19 IN2 Control Input 2 (pullup to VCC) 20 DGND Digital Ground. HEAT SLUG Internally Connected to AGND; Device Substrate AGND 1 SCLK IN1 CHP VS OUT1 OUT1 SO SI GND DGND IN2 DIS/SF CSB VS OUT2 OUT2 EN VCC GND HEAT SLUG Figure 3. Package Pinout (Top View) http://onsemi.com 4 NCV7729 MAXIMUM RATINGS (Voltages are with respect to device substrate.) Rating Value Unit Battery Supply and Power Outputs (VS, OUTx) (DC) (AC), t < 500 ms V −1 to 40 −2 Digital Supply (VCC), Logic input/output pins (EN, DIS/SF, INx, CSB,SCLK, SO, SI) V −0.5 to 18 Charge pump Supply, relative to VS V(CHP) − V(VS) 16 V Operating Junction Temperature Continuous t<1s °C −40 to 150 175 Storage Temperature Range −65 to 150 °C Peak Reflow Soldering Temperature: Pb−Free − 60 to 150 seconds at 217°C (Note 1) 260 peak °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D, and Application Note AND8003/D. ATTRIBUTES Characteristic Value.


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