Document
NCV7729
8 A H-Bridge Driver
The NCV7729 is an intelligent, fully protected H−Bridge Driver designed specifically for control of DC and stepper motors in safety critical applications under automotive/industrial environment.
Features
• Operating VS Battery Supply Voltage 5 V to 28 V • Operating VCC Supply Voltage 3.0 to 5.5 V • 18 V Survivability on VCC and All Logic I/O Pins • Typical RDS(on) = 150 mW, RDS(MAX) = 300 mW (150°C) • Continuous DC Load Current 5A (TC < 100°C) • Selectable Output Current Limitation (2.5 A to 9.6 A) • Output Switching Frequency Up to 30 kHz • Monitoring of All Supply Voltages, Safe Power−up State • Loss of GND Detection • Short−Circuit Protection and Thermal Shutdown • Full Diagnosis Capability for Open Load, Short to GND/VS and
Shorted Load Conditions
• SPI Interface for Configuration and Diagnosis • Undervoltage Lockout • Regulated Charge Pump for Optimized EMI Behavior • NCV Prefix for Automotive and Other Applications Requiring
Unique Site and Control Change Requirements
• This is a Pb−Free Device
Typical Applications
• Automotive
♦ Electronic Throttle Control (ETC) ♦ Variable Intake Geometry ♦ Exhaust Gas Recirculation ♦ Variable Swirl ♦ Blow−off Flap
• Industrial
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PSOP−20 CASE 525AB
MARKING DIAGRAM
20
11
NCV7729BG AWLYYWWG
1
10
A
= Assembly Location
WL = Wafer Lot
YY
= Year
WW = Work Week
G
= Pb−Free Package
ORDERING INFORMATION
Device
Package
Shipping†
NCV7729BPPR2G PSOP−20 (Pb−Free)
750 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2014
1
August, 2014 − Rev. 2
Publication Order Number: NCV7729/D
VCC 12
NCV7729
CHP 4
Core Functions Biasing and Supply
Regulated Chargepump
VS 5,16
IN1 3 IN2 19 EN 13 DIS/SF 18
CSB 17 SCLK 2
SI 9 SO 8
16bit SPI−I/F
Control Logic Driver &
Gate Control
6,7 14,15
OUT1 OUT2
GND Loss Detection
1
20
AGND
DGND
Output Protection and Diagnostics
10,11
GND
Figure 1. Block Diagram
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SUPERVISOR mC
MAIN mC
REG1 5V / 3.3V
REG2 5V / 3.3V
NCV7729
REVERSE BATTERY
& TRANSIENT
PROTECTION
VBAT VBAT
VCC 12
CHP 4
Core Functions Biasing and
Supply
Regulated Chargepump
CBUF 22 nF
100mF 100nF
VS 5,16
16bit SPI−I/F
Control Logic Ddriver &
Gate Control
IN1 3 IN2 19 EN 13 DIS/SF 18
CSB 17 SCLK 2
SI 9 SO 8
GND Loss Detection
1
20
AGND
DGND
6,7 14,15
OUT1
OUT2 M
Output Protection and Diagnostics
10,11
GND
Figure 2. ETC Application Diagram
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NCV7729
PACKAGE PIN DESCRIPTION
Pin#
Symbol
Description
1
AGND Analog Ground; Device Substrate.
2
SCLK Serial Clock. Clock input for SPI communication (internal pullup to VCC)
3
IN1
Control Input 1 (internal pullup to VCC)
4
CHP Charge pump in/output
5
VS
Supply voltage; must be connected to pin 16 externally
6
OUT1 Output1; must be connected to pin 7 externally
7
OUT1 Output1; must be connected to pin 6 externally
8
SO
Serial Output. 16 bit SPI communications output.
9
SI
Serial Input. 16 bit SPI communications input (internal pullup to VCC)
10
GND Power Ground.
11
GND Power Ground.
12
VCC Power supply for logic
13
EN
Enable input (internal pulldown to AGND)
14
OUT2 Output2; connect to pin 15 externally
15
OUT2 Output2; connect to pin 14 externally
16
VS
Supply voltage; must be connected to pin 5 externally
17
CSB
Chip Select Bar Input. Active low SPI port operation (internal pullup to VCC)
18
DIS/SF Disable Input / Status Flag Output (Open drain w/ internal pullup to VCC)
19
IN2
Control Input 2 (pullup to VCC)
20
DGND Digital Ground.
HEAT SLUG
Internally Connected to AGND; Device Substrate
AGND 1 SCLK
IN1 CHP
VS OUT1 OUT1
SO SI GND
DGND IN2 DIS/SF CSB VS OUT2 OUT2 EN VCC GND
HEAT SLUG Figure 3. Package Pinout
(Top View)
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NCV7729
MAXIMUM RATINGS (Voltages are with respect to device substrate.)
Rating
Value
Unit
Battery Supply and Power Outputs (VS, OUTx) (DC) (AC), t < 500 ms
V −1 to 40
−2
Digital Supply (VCC), Logic input/output pins (EN, DIS/SF, INx, CSB,SCLK, SO, SI)
V −0.5 to 18
Charge pump Supply, relative to VS V(CHP) − V(VS)
16
V
Operating Junction Temperature Continuous t<1s
°C −40 to 150
175
Storage Temperature Range
−65 to 150
°C
Peak Reflow Soldering Temperature: Pb−Free − 60 to 150 seconds at 217°C (Note 1)
260 peak
°C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. For additional information, see or download ON Semiconductor’s Soldering and Mounting Techniques Reference Manual, SOLDERRM/D,
and Application Note AND8003/D.
ATTRIBUTES
Characteristic
Value.