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L3G4200DH Dataheets PDF



Part Number L3G4200DH
Manufacturers ST Microelectronics
Logo ST Microelectronics
Description MEMS motion sensor: three-axis digital output gyroscope
Datasheet L3G4200DH DatasheetL3G4200DH Datasheet (PDF)

www.DataSheet4U.com L3G4200DH MEMS motion sensor: three-axis digital output gyroscope Preliminary data Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Three selectable full scales (250/500/2000 dps) I2C/SPI digital output interface 16 bit-rate value data output 8-bit temperature data output Two digital output lines (interrupt and data ready) Integrated low- and high-pass filters with userselectable bandwidth Embedded self-test Wide supply voltage: 2.4 V to 3.6 V Low voltage-compatible IOs (1.8 V) Embe.

  L3G4200DH   L3G4200DH


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www.DataSheet4U.com L3G4200DH MEMS motion sensor: three-axis digital output gyroscope Preliminary data Features ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ ■ Three selectable full scales (250/500/2000 dps) I2C/SPI digital output interface 16 bit-rate value data output 8-bit temperature data output Two digital output lines (interrupt and data ready) Integrated low- and high-pass filters with userselectable bandwidth Embedded self-test Wide supply voltage: 2.4 V to 3.6 V Low voltage-compatible IOs (1.8 V) Embedded power-down and sleep mode Embedded temperature sensor 96 levels of 16-bit data output (FIFO) High shock survivability Extended operating temperature range (-40 °C to +85 °C) ECOPACK® RoHS and “Green” compliant (see Section 5) LGA-16 (4x4x1.1 mm) Description The L3G4200DH is a low-power three-axis angular rate sensor. It includes a sensing element and an IC interface capable of providing the measured angular rate to the external world through a digital interface (I2C/SPI). The sensing element is manufactured using a dedicated micro-machining process developed by STMicroelectronics to produce inertial sensors and actuators on silicon wafers. The IC interface is manufactured using a CMOS process that allows a high level of integration to design a dedicated circuit which is trimmed to better match the sensing element characteristics. The L3G4200DH has a full scale of ±250/±500/ ±2000 dps and is capable of measuring rates with a user-selectable bandwidth. The L3G4200DH is available in a plastic land grid array (LGA) package and can operate within a temperature range from -40 °C to +85 °C. Applications ■ ■ ■ ■ Gaming and virtual reality input devices Motion control with MMI (man-machine interface) GPS navigation systems Appliances and robotics Table 1. Device summary Temperature range (°C) -40 to +85 -40 to +85 Package LGA-16 (4x4x1.1 mm) LGA-16 (4x4x1.1 mm) Packing Tray Tape and reel Order code L3G4200DH L3G4200DHTR April 2010 Doc ID 17300 Rev 1 1/28 www.st.com 28 This is preliminary information on a new product now in development or undergoing evaluation. Details are subject to change without notice. www.DataSheet4U.com Contents L3G4200DH Contents 1 Block diagram and pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 1.1 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Mechanical and electrical specifications . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 2.2 2.3 2.4 Mechanical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Temperature sensor characteristics 2.4.1 2.4.2 ............................. 9 Communication interface characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 10 SPI - serial peripheral interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 I2C - inter IC control interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.5 2.6 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Terminology . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.6.1 2.6.2 2.6.3 Sensitivity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Zero-rate level . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Self-test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.7 Soldering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 3 Main digital blocks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 3.2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.2.1 3.2.2 3.2.3 3.2.4 3.2.5 3.2.6 Bypass mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Bypass-to-stream mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Stream-to-FIFO mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Retrieve data from FIFO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4 Digital interfaces . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.1 4.2 I2C serial interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 4.1.1 I2C.


ADXRS624 L3G4200DH ADIS16135


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