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28F160C3 Dataheets PDF



Part Number 28F160C3
Manufacturers Intel Corporation
Logo Intel Corporation
Description 3 Volt Advanced+ Boot Block Flash Memory
Datasheet 28F160C3 Datasheet28F160C3 Datasheet (PDF)

www.DataSheet4U.com Intel£ Advanced+ Boot Block Flash Memory (C3) 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features ■ ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V Read/Program/Erase — 12 V for Fast Production Programming 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option — Reduces Overall System Power High Performance — 2.7 V– 3.6 V: 70 ns Max Access Time Optimized Architecture for Code Plus Data Storage — Eight 4 Kword Blocks, Top or Bottom Parameter Boot — Up .

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www.DataSheet4U.com Intel£ Advanced+ Boot Block Flash Memory (C3) 28F800C3, 28F160C3, 28F320C3, 28F640C3 (x16) Datasheet Product Features ■ ■ ■ ■ ■ ■ ■ Flexible SmartVoltage Technology — 2.7 V– 3.6 V Read/Program/Erase — 12 V for Fast Production Programming 1.65 V–2.5 V or 2.7 V–3.6 V I/O Option — Reduces Overall System Power High Performance — 2.7 V– 3.6 V: 70 ns Max Access Time Optimized Architecture for Code Plus Data Storage — Eight 4 Kword Blocks, Top or Bottom Parameter Boot — Up to One Hundred-Twenty-Seven 32 Kword Blocks — Fast Program Suspend Capability — Fast Erase Suspend Capability Flexible Block Locking — Lock/Unlock Any Block — Full Protection on Power-Up — WP# Pin for Hardware Block Protection Low Power Consumption — 9 mA Typical Read — 7 A Typical Standby with Automatic Power Savings Feature (APS) Extended Temperature Operation — –40 °C to +85 °C ■ ■ ■ ■ ■ ■ ■ 128-bit Protection Register — 64 bit Unique Device Identifier — 64 bit User Programmable OTP Cells Extended Cycling Capability — Minimum 100,000 Block Erase Cycles Software — Intel® Flash Data Integrator (FDI) — Supports Top or Bottom Boot Storage, Streaming Data (e.g., voice) — Intel Basic Command Set — Common Flash Interface (CFI) Standard Surface Mount Packaging — 48-Ball µBGA*/VFBGA — 64-Ball Easy BGA Packages — 48-Lead TSOP Package ETOX™ VIII (0.13 µm) Flash Technology — 16, 32 Mbit ETOX™ VII (0.18 µm) Flash Technology — 16, 32, 64 Mbit ETOX™ VI (0.25 µm) Flash Technology — 8, 16 and 32 Mbit The Intel® Advanced+ Book Block Flash Memory (C3) device, manufactured on Intel’s latest 0.13 µm and 0.18 µm technologies, represents a feature-rich solution for low-power applications. The C3 device incorporates low-voltage capability (3 V read, program, and erase) with highspeed, low-power operation. Flexible block locking allows any block to be independently locked or unlocked. Add to this the Intel® Flash Data Integrator (FDI) software and you have a costeffective, flexible, monolithic code plus data storage solution. Intel® Advanced+ Boot Block Flash Memory (C3) products will be available in 48-lead TSOP, 48-ball CSP, and 64-ball Easy BGA packages. Additional information on this product family can be obtained by accessing the Intel® Flash website: http://www.intel.com/design/flash. Notice: This specification is subject to change without notice. Verify with your local Intel sales office that you have the latest datasheet before finalizing a design. Order Number: 290645-016 May 2003 www.DataSheet4U.com INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS. NO LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE, TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT. EXCEPT AS PROVIDED IN INTEL'S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS, INTEL ASSUMES NO LIABILITY WHATSOEVER, AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY, RELATING TO SALE AND/OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE, MERCHANTABILITY, OR INFRINGEMENT OF ANY PATENT, COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT. Intel products are not intended for use in medical, life saving, or life sustaining applications. Intel may make changes to specifications and product descriptions at any time, without notice. Designers must not rely on the absence or characteristics of any features or instructions marked "reserved" or "undefined." Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them. The 28F800C3, 28F160C3, 28F320C3, 28F640C3 may contain design defects or errors known as errata which may cause the product to deviate from published specifications. Current characterized errata are available on request. Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order. Copies of documents which have an ordering number and are referenced in this document, or other Intel literature may be obtained by calling 1-800548-4725 or by visiting Intel's website at http://www.intel.com. Copyright © Intel Corporation, 2003 *Third-party brands and names are the property of their respective owners. 2 Datasheet www.DataSheet4U.com Contents Contents 1.0 Introduction ....................................................................................................................................7 1.1 1.2 1.3 2.0 2.1 2.2 2.3 2.4 2.5 3.0 3.1 Document Purpose ...............................................................................................................7 Nomenclature .......................................................................................................................7 Conventions..........................................................................................................................7 Product Overview ..........................................................


28F800C3 28F160C3 28F640C3


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