EMIF02-MIC07F3

www.DataSheet4U.com EMIF02-MIC07F3 EMI filter and ESD protection Features ■ ■ ■ ■ ■ ■ EMI symmetrical (I/O) low-pass filter High efficiency in EMI/ESD protection Lead-free package Very thin package High reliability offered by monolithic integration High reduction of parasitic elements through integration and wafer level packaging Lead-free Flip-Chip package (8 bumps) Complies with the following standards ■ IEC 61000-4-2 level 4 (on external pins B1 and C1) – + 15 kV (air discharge) – + 8 kV (contact discharge) IEC 61000-4-2 level 1 (on external pins) – + 2 kV (air discharge) – + 2 kV (contact discharge) Figure 1. Pin configuration (bump side) 3 MIC Bias 2 Acc_Det 1 A Mic2p ■ Op Gnd B C Applications Where EMI filtering in ESD sensitive equipment is required: ■ ■ On Gnd Mic2n Mobile phones and communication systems Computers, printers and MCU Boards Figure 2. Schematic GND Acc_Det Description The EMIF02-MIC07F3 chip is a highly integrated audio filter device designed to suppress EMI/RFI noise in all systems subjected to electromagnetic interference. This filter includes ESD protection circuitry, which prevents damage to the protected device when subjected to ESD surges up to 15 kV. B1 Mic2p Mic2n C1 GND C11 R31 A2 Mic Bias A3 R11 R21 GND C21 C31 B3 C32 to ASIC C3 C22 GND R22 R12 GND C12 GND GND B2 and C2 are ground bumps and must be connected together TM: IPAD is a trademark of STMicroelectronics. March 2010 Doc ID 17052 Rev 1 1/7 www.st.com 7 ...