Power MOSFET
PD -96175 www.DataSheet4U.com
IRFP4568PbF
HEXFET® Power MOSFET
Applications l High Efficiency Synchronous Rectification...
Description
PD -96175 www.DataSheet4U.com
IRFP4568PbF
HEXFET® Power MOSFET
Applications l High Efficiency Synchronous Rectification in SMPS l Uninterruptible Power Supply l High Speed Power Switching l Hard Switched and High Frequency Circuits Benefits l Improved Gate, Avalanche and Dynamic dV/dt Ruggedness l Fully Characterized Capacitance and Avalanche SOA l Enhanced body diode dV/dt and dI/dt Capability l Lead-Free
D
G S
VDSS RDS(on) typ. max. ID (Silicon Limited)
D
150V 4.8m: 5.9m: 171
G
D
S
TO-247AC IRFP4568PbF
G
D
S
Gate
Drain
Source
Absolute Maximum Ratings
Symbol
ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VGS dv/dt TJ TSTG
Parameter
Continuous Drain Current, VGS @ 10V (Silicon Limited) Continuous Drain Current, VGS @ 10V (Silicon Limited) Pulsed Drain Current Maximum Power Dissipation Linear Derating Factor Gate-to-Source Voltage Peak Diode Recovery Operating Junction and Storage Temperature Range Soldering Temperature, for 10 seconds (1.6mm from case) Mounting torque, 6-32 or M3 screw
Max.
171 121 684 517 3.45 ± 30 18.5 -55 to + 175 300 10lb in (1.1N m) 763 See Fig. 14, 15, 22a, 22b,
Units
A W W/°C V V/ns
e
°C
x
x
Avalanche Characteristics
EAS (Thermally limited) IAR EAR Single Pulse Avalanche Energy Avalanche Current Repetitive Avalanche Energy
Ã
d
f
mJ A mJ
Thermal Resistance
Symbol
RθJC RθCS RθJA Junction-to-Case Case-to-Sink, Flat Greased Surface Junction-to-Ambient
j
Parameter
Typ.
––– 0.24 –––
Max.
0.29 ––– 40
Units
°C/W
ij
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