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GANGES TECHNOLOGY
Ferrite Chip Bead For High Current Applications
HCB Series
P1. www.DataSheet4U.com
High Current Chip Bead
1. Features
HCB/HPB□□□□-series for Large Current Application
HCB/HPB Series
The HCB/HPB series can be used in high current circuits due to its low DC resistance. It can match power lines to maximum of 6A DC.
2. Dimension
D
Chip size Size
1608
A(mm)
1.6±0.15 2.0±0.20 3.2±0.20 3.2±0.20 4.5±0.20 4.5±0.20 5.7±0.2
B(mm)
0.80±0.15 1.25±0.20 1.60±0.20 2.50±0.20 1.60±0.20 3.20±0.20 5.0±0.3
C(mm)
0.80±0.15 0.85±0.20 1.10±0.20 1.30±0.20 1.60±0.20 1.50±0.20 1.8±0.2
D(mm)
0.30±0.2 0.50±0.3 0.50±0.3 0.50±0.3 0.50±0.3 0.50±0.3 0.5±0.3
A
2012 3216 3225
C
4516
B
4532 5750
3. Part Numbering HCB
A A: Series B: Dimension C: Material D: Impedance E: Packaging F: Rated Current 301=300Ω , 300=30Ω T=Taping and Reel , B=Bulk(Bags) 10=1000mA=1A LxW
3216
B
K
C
-
301
D
T
E
10
F
4.Specification
Customer Part Number YOSONIC Part Number
HCB1608K-300T30 HCB1608K-800T30 HCB1608K-121T20 HCB1608K-151T20 HCB1608K-221T20 HCB1608K-301T10 HCB1608K-471T10 HCB1608K-601T10 HCB2012K-300T30 HCB2012K-800T30 HCB2012K-121T20 HCB2012K-151T20
Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max.
30±25% 80±25% 120±25% 150±25% 220±25% 300±25% 470±25% 600±25% 30±25% 80±25% 120±25% 150±25% 100 100 100 100 100 100 100 100 100 100 100 100 3000 3000 2000 2000 2000 1000 1000 1000 3000 3000 2000 2000 0.04 0.04 0.10 0.10 0.10 0.20
Reference
For Large Current 0.20 0.20 0.04 0.04 0.10 0.10
P2. www.DataSheet4U.com Customer Part Number YOSONIC Part Number
HCB2012K-221T20 HCB2012K-301T10 HCB2012K-471T10 HCB2012K-601T10 HPB2012Z-300T50 HPB2012Z-101T40 HPB2012Z-221T30 HPB2012Z-331T25 HPB2012Z-471T20 HPB2012Z-601T15 HCB3216K-300T30 HCB3216K-500T30 HCB3216K-800T30 HCB3216K-121T20 HCB3216K-151T20 HCB3216K-301T10 HCB3216K-471T10 HCB3216K-501T30 HCB3216K-601T20 HCB3225K-600T40 HCB3225K-900T20 HCB3225K-151T50 HCB3225K-201T40 HCB4516K-600T60 HCB4516K-800T30 HCB4516C-102T15 HCB4532K-800T60 HCB4532K-131T30 HCB4532K-151T50 HCB4532H-681T40 HCB4532H-132T30 HCB4532M-132T30 HCB5750V-101T60 HCB5750V-151T30 HCB5750V-181T30 HCB5750H-601T30
Impedance Test Frequency Rated Current DCR (Ohm) (MHz) (mA) max. (Ohm) max.
220±25% 300±25% 470±25% 600±25% 30±25% 100±25% 220±25% 330±25% 470±25% 600±25% 30 ±25% 50 ±25% 80 ±25% 120 ±25% 150 ±25% 300 ±25% 470 ±25% 500 ±25% 600 ±25% 60 ±25% 90 ±25% 150 ±25% 200 ±25% 60 ±25% 80 ±25% 1000 ±25% 80 ±25% 130 ±25% 150 ±25% 680±25% 1300 ±25% 1300 ±25% 100 ±25% 150 ±25% 180 ±25% 600 ±25% 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 60 100 100 100 100 100 2000 1000 1000 1000 5000 4000 3000 2500 2000 1500 3000 3000 3000 2000 2000 1000 1000 3000 2000 4000 2000 5000 4000 6000 3000 1500 6000 3000 5000 4000 3000 3000 6000 3000 3000 3000 0.10 0.20 0.20 0.20 0.01 0.02 0.04 0.05 0.08 0.10 0.04 0.04 0.04 0.10 0.10 0.20 0.20 0.04
Reference
For Large Current 0.10 0.03 0.10 0.02 0.03 0.01 0.04 0.15 0.01 0.04 0.02 0.03 0.06 0.06 0.01 0.04 0.04 0.04
5. Reliability and Test Condition
Item
Operating Temperature Storage temperature and humidity range Impedance
Performance
-55~+125℃ -55~+125℃ 70%RH (max)
Test Condition
HP4291A, HP4287A+16092A
Refer to standard electrical characteristics list
DC Resistance Rated Current HP4338B
1000~6000mA (HCB), 1500~5000mA (HPB)
P3. Test Condition
Item
Performance
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Temperature Rise Test
30℃ max. (Δt)
1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer.
Preheating Dipping Natural cooling 260°C
Preheat:150℃,60sec. Solder : H63A Solder tamperature:260±5℃ Flux: rosin
Solder heat Resistance
Appearance: No significant abnormality. Impedance change: Within ± 30%.
150°C second second
Dip time:10±0.5sec.
Preheating Dipping Natural cooling
Preheat:150℃,60sec. Solder : H63A Solder tamperature:230±5℃ Flux: rosin
More than 90% of the terminal
Solderability
230°C
electrode should be covered with solder.
150°C second second
Dip time:4±1sec.
For HCB HPB: Size 1608 2012 3216 3225 4516 4532 5750 Force (Kfg) 0.5 0.6 1.0 1.0 1.0 1.5 2.0 >25 Time(sec)
The terminal electrode and the dielectric must
Terminal strength
W
not be damaged by the forces applied on the right conditions.
20(.787)
The terminal electrode and the dielectric must
Flexture strength
Bending
45(1.772) 45(1.772)
not be damaged by the forces applied on the right conditions.
Solder a chip on a test substrate, bend the substrate by 2mm (0.079in)and return.
40(1.575)
100(3.937)
Series name mm(inches) 1608 2012 3216 3225 0.80(0.033) 0.14(0.055) 2.00(0.079) 2.70(0.106)
P-Kgf 0.3 1.0 2.5 2.5
The ferrite should not be damaged by
Bending Strength
R 0.5(0.02)
Forces applied on the right condition.
A
4516 4532
Temperature:125±5℃. Loading at High Temperature
Appearance: no damage. Impedance: within±30%of initial value.
Applied current:rated c.