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UPD78F0546 Dataheets PDF



Part Number UPD78F0546
Manufacturers NEC
Logo NEC
Description (UPD78F054x) 8-Bit Single-Chip Microcontrollers
Datasheet UPD78F0546 DatasheetUPD78F0546 Datasheet (PDF)

www.DataSheet4U.com User’s Manual 78K0/KF2 8-Bit Single-Chip Microcontrollers µPD78F0544 µPD78F0545 µPD78F0546 µPD78F0547 µPD78F0547D µPD78F0544(A) µPD78F0545(A) µPD78F0546(A) µPD78F0547(A) The µPD78F0547D has an on-chip debug function. Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function has been used, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics does not accept comp.

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www.DataSheet4U.com User’s Manual 78K0/KF2 8-Bit Single-Chip Microcontrollers µPD78F0544 µPD78F0545 µPD78F0546 µPD78F0547 µPD78F0547D µPD78F0544(A) µPD78F0545(A) µPD78F0546(A) µPD78F0547(A) The µPD78F0547D has an on-chip debug function. Do not use this product for mass production because its reliability cannot be guaranteed after the on-chip debug function has been used, due to issues with respect to the number of times the flash memory can be rewritten. NEC Electronics does not accept complaints concerning this product. Document No. U17397EJ4V0UD00 (4th edition) Date Published May 2006 NS CP(K) 2005 Printed in Japan www.DataSheet4U.com [MEMO] 2 User’s Manual U17397EJ4V0UD www.DataSheet4U.com NOTES FOR CMOS DEVICES 1 VOLTAGE APPLICATION WAVEFORM AT INPUT PIN Waveform distortion due to input noise or a reflected wave may cause malfunction. If the input of the CMOS device stays in the area between VIL (MAX) and VIH (MIN) due to noise, etc., the device may malfunction. Take care to prevent chattering noise from entering the device when the input level is fixed, and also in the transition period when the input level passes through the area between VIL (MAX) and VIH (MIN). 2 HANDLING OF UNUSED INPUT PINS Unconnected CMOS device inputs can be cause of malfunction. If an input pin is unconnected, it is possible that an internal input level may be generated due to noise, etc., causing malfunction. CMOS devices behave differently than Bipolar or NMOS devices. Input levels of CMOS devices must be fixed high or low by using pull-up or pull-down circuitry. Each unused pin should be connected to VDD or GND via a resistor if there is a possibility that it will be an output pin. All handling related to unused pins must be judged separately for each device and according to related specifications governing the device. 3 PRECAUTION AGAINST ESD A strong electric field, when exposed to a MOS device, can cause destruction of the gate oxide and ultimately degrade the device operation. Steps must be taken to stop generation of static electricity as much as possible, and quickly dissipate it when it has occurred. Environmental control must be adequate. When it is dry, a humidifier should be used. It is recommended to avoid using insulators that easily build up static electricity. Semiconductor devices must be stored and transported in an anti-static container, static shielding bag or conductive material. All test and measurement tools including work benches and floors should be grounded. The operator should be grounded using a wrist strap. Semiconductor devices must not be touched with bare hands. Similar precautions need to be taken for PW boards with mounted semiconductor devices. 4 STATUS BEFORE INITIALIZATION Power-on does not necessarily define the initial status of a MOS device. Immediately after the power source is turned ON, devices with reset functions have not yet been initialized. Hence, power-on does not guarantee output pin levels, I/O set.


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