IRGP4086PBF

PDP TRENCH IGBT PD - 97132 IRGP4086PbF Features Key Parameters l Advanced Trench IGBT Technology VCE min 300 V l Optimized for Sustain and Energy Recovery VCE(ON) typ. @ IC = 70A 1.90 V Circuits in PDP Applications l Low VCE(on) and Energy per Pulse (EPULSETM) for Improved Panel Efficiency IRP max @ TC= 25°C c TJ max 250 150 A °C l High Repetitive Peak Current Capability l Lead Free Package C C G E n-channel E C G TO-247AC G G a te C C o lle c to r E Em itter Description This IGBT is specifically designed for applications in Plasma Display Panels. This device utilizes advanced trench IGBT technology to achieve low VCE(on) and low EPULSETM rating per silicon area which improve panel efficiency. Additional features are 150°C operating junction temperature and high repetitive peak current capability. These features combine to make this IGBT a highly efficient, robust and reliable device for PDP applications. Absolute Maximum Ratings Parameter VGE IC @ TC = 25°C IC @ TC = 100°C IRP @ TC = 25°C PD @TC = 25°C PD @TC = 100°C Gate-to-Emitter Voltage Continuous Collector Current, VGE @ 15V Continuous Collector, VGE @ 15V Repetitive Peak Current c Power Dissipation Power Dissipation Linear Derating Factor TJ TSTG Operating Junction and Storage Temperature Range Soldering Temperature for 10 seconds Mounting Torque, 6-32 or M3 Screw Thermal Resistance RθJC (IGBT) RθCS RθJA Parameter Thermal Resistance Junction-to-Case-(each IGBT) d Case-to-Sink (flat, g...