10.3 Gbps Coplanar GaAs PIN Photo Diode
INTEGRATED PRODUCTS
Obsolete Product – Not Recommended For New Design
LX3044 / 45 / 46
10.3 Gbps Coplanar GaAs PIN Phot...
Description
INTEGRATED PRODUCTS
Obsolete Product – Not Recommended For New Design
LX3044 / 45 / 46
10.3 Gbps Coplanar GaAs PIN Photo Diode
PRODUCTION DATA SHEET
WWW.Microsemi .COM
DESCRIPTION
KEY FEATURES
Microsemi’s GaAs Coplanar PIN The LX304X family of photo diodes
LX3044 Single Die
Photo Diode chips are ideal for high are currently offered in die form
LX3045, 1x4 Array Die
bandwidth 850nm optical networking allowing manufacturers the versatility
applications.
of custom assembly using either bond
The device family offers superior wire or flip chip configurations.
LX3046, 1x12 Array Die Coplanar Waveguide , 50ohm High Responsivity Low Dark Current
noise performance and sensitivity in This device is ideal for
single die, 1x4 array die or 1x12 array manufacturers of optical receivers,
die.
transponders, optical transmission
modules and combination PIN photo
diode – transimpedance amplifier.
te IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com
le PRODUCT HIGHLIGHT
o Coplanar Design (gnd-signal-gnd) 50 ohm characteristic impedance 125µm standard pad pitch for ease of test Large 75µm x 75µm pad size for ease of
packaging
s Wire bond or Flip Chip capability
Single Die
High Bandwidth Anode/Cathode on Illuminated
Side 125mm Pad pitch Die Good for Bond Wire or Flip
Chip Applications
APPLICATIONS
Short Reach Optical Networks 10Gigabit Ethernet, Fibre
Channel VCSEL Array Receiver
BENEFITS
Large W...
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