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NLX2G04 Dataheets PDF



Part Number NLX2G04
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Dual Inverter
Datasheet NLX2G04 DatasheetNLX2G04 Datasheet (PDF)

NLX2G04 Dual Inverter The NLX2G04 MiniGatet is an advanced high-speed CMOS dual inverter in ultra-small footprint. The NLX2G04 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. Features http://onsemi.com MARKING DIAGRAMS ULLGA6 1.0 x 1.0 CASE 613AD M Q •ăHigh Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V •ăLow Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •ăPower Down Protection Provided on inputs •ăBalanced Propagation Delays •.

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NLX2G04 Dual Inverter The NLX2G04 MiniGatet is an advanced high-speed CMOS dual inverter in ultra-small footprint. The NLX2G04 input and output structures provide protection when voltages up to 7.0 V are applied, regardless of the supply voltage. Features http://onsemi.com MARKING DIAGRAMS ULLGA6 1.0 x 1.0 CASE 613AD M Q •ăHigh Speed: tPD = 1.8 ns (Typ) @ VCC = 5.0 V •ăLow Power Dissipation: ICC = 1 mA (Max) at TA = 25°C •ăPower Down Protection Provided on inputs •ăBalanced Propagation Delays •ăOvervoltage Tolerant (OVT) Input and Output Pins •ăUltra-Small Packages •ăThese are Pb-Free Devices 1 1 IN A1 1 6 OUT Y1 ULLGA6 1.2 x 1.0 CASE 613AE M Q GND 2 5 VCC ULLGA6 1.45 x 1.0 CASE 613AF 1 Q M = Device Marking = Date Code M Q IN A2 3 4 OUT Y2 Figure 1. Pinout (Top View) 1 2 3 IN A1 IN A2 1 1 OUT Y1 OUT Y2 4 5 6 PIN ASSIGNMENT IN A1 GND IN A2 OUT Y2 VCC OUT Y1 Figure 2. Logic Symbol FUNCTION TABLE A L H Y H L ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 5 of this data sheet. ©Ă Semiconductor Components Industries, LLC, 2008 1 March, 2008 - Rev. 0 Publication Order Number: NLX2G04/D www.DataSheet.in NLX2G04 MAXIMUM RATINGS Symbol VCC VIN VOUT IIK IOK IO ICC IGND TSTG TL TJ MSL FR ILATCHUP DC Supply Voltage DC Input Voltage DC Output Voltage DC Input Diode Current DC Output Diode Current DC Output Source/Sink Current DC Supply Current Per Supply Pin DC Ground Current per Ground Pin Storage Temperature Range Lead Temperature, 1 mm from Case for 10 Seconds Junction Temperature Under Bias Moisture Sensitivity Flammability Rating Oxygen Index: 28 to 34 VIN < GND VOUT < GND Parameter Value -0.5 to +7.0 -0.5 to +7.0 -0.5 to +7.0 -50 -50 ±50 ±100 ±100 -65 to +150 260 150 Level 1 UL 94 V-0 @ 0.125 in ±500 mA Unit V V V mA mA mA mA mA °C °C °C Latchup Performance Above VCC and Below GND at 125 °C (Note 2) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Measured with minimum pad spacing on an FR4 board, using 10 mm-by-1 inch, 2 ounce copper trace no air flow. 2. Tested to EIA / JESD78. RECOMMENDED OPERATING CONDITIONS Symbol VCC VIN VOUT TA Dt/DV Positive DC Supply Voltage Digital Input Voltage Output Voltage Operating Free-Air Temperature Input Transition Rise or Fall Rate VCC = 2.5 V ± 0.2 V VCC = 3.3 V ± 0.3 V VCC = 5.0 V ± 0.5 V Parameter Min 1.65 0 0 -55 0 0 0 Max 5.5 5.5 5.5 +125 20 10 5 Unit V V V °C ns/V http://onsemi.com 2 www.DataSheet.in NLX2G04 DC ELECTRICAL CHARACTERISTICS TA = 25 5C Min 0.75 x VCC 0.70 x VCC 0.25 x VCC 0.30 x VCC VCC0.1 1.29 1.9 2.2 2.4 2.3 3.8 VCC VCC0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 0.1 Typ Max TA = +855C Min 0.75 x VCC 0.70 x VCC 0.25 x VCC 0.30 x VCC VCC0.1 1.29 1.9 2.2 2.4 2.3 3.8 0.1 V Max TA = -555C to +1255C Min 0.75 x VCC 0.70 x VCC 0.25 x VCC 0.30 x VCC V V Max Unit V Symbol VIH Parameter Low-Level Input Voltage Conditions VCC (V) 1.65-1.95 2.3 to 5.5 1.65-1.95 2.3 - 5.5 VIL Low-Level Input Voltage VOH HighLevel Output Voltage VIN = VIH or VIL IOH = -100 mA VIN = VIH or VIL IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA VIN = VIH or VIL IOL = 100 mA VIN = VIH or VIL IOH = -4 mA IOH = -8 mA IOH = -12 mA IOH = -16 mA IOH = -24 mA IOH = -32 mA 0 v VIN v 5.5 V 1.65 - 5.5 1.65 2.3 2.7 3.0 3.0 4.5 1.65 - 5.5 1.52 2.1 2.4 2.7 2.5 4.0 VOL Low-Level Output Voltage 1.65 2.3 2.7 3.0 3.0 4.5 0 to 5.5 0.08 0.2 0.22 0.28 0.38 0.42 0.24 0.3 0.4 0.4 0.55 0.55 ±0.1 0.24 0.3 0.4 0.4 0.55 0.55 ±1.0 0.24 0.3 0.4 0.4 0.55 0.55 ±1.0 mA IIN Input Leakage Current Power-Off Output Leakage Current Quiescent Supply Current IOFF VIN or VOUT = 5.5 V 0 1.0 10 10 mA ICC 0 v VIN v VCC 5.5 1.0 10 10 mA http://onsemi.com 3 www.DataSheet.in NLX2G04 AC ELECTRICAL CHARACTERISTICS (Input tr = tf = 3.0 nS) TA = 25 5C Min 1.8 1.8 1.2 0.8 1.2 0.5 0.8 Typ 2.3 4.4 3.0 2.2 2.9 1.8 2.3 2.5 9 11 Max 9.2 7.6 5.1 3.4 4.5 2.8 3.6 TA = -555C to +1255C Min 1.8 1.2 1.2 0.8 1.2 0.5 0.8 Max 11 8.4 5.6 3.8 5.0 3.1 4.0 pF pF Unit ns Symbol tPLH, tPHL Parameter Propagation Delay, Input A to Output Y VCC (V) 1.65 1.8 2.3-2.7 3.0-3.6 Test Condition RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF 4.5-5.5 RL = 1 MW, CL = 15 pF RL = 500 W, CL = 50 pF CIN CPD Input Capacitance Power Dissipation Capacitance (Note 3) 5.5 3.3 5.5 VIN = 0 V or VCC 10 MHz VIN = 0 V or VCC 3. CPD is defined as the value of the internal equivalent capacitance which is calculated from the dynamic operating current consumption without load. Average operating current can be obtained by the equation ICC(OPR) = CPD • VCC • fin + ICC. CPD is used to determine the no-load dynamic power consumption: PD = CPD .


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