EP3C16

Cyclone Series Device Thermal Resistance May 2008, version 3.0 Data Sheet Revision History Date May 2008 July 2007 May 2007 March 2007 April 2006 The following table shows the revision history for this data sheet. Document Version 3.0 2.2 2.1 2.0 1.0 Changes Made Updated Tables 2, 4, and 5. Updated values for EP3C25 (E144) device in Table 2. Updated values for EP3C10 (E144) device in Table 2 and added Revision History. Added Cyclone III information. Initial release. Tables 1 through 6 in this data sheet provide θ JA (junction-to-ambient thermal resistance) and θ JC (junction-to-case thermal resistance) values for Altera® Cyclone® series devices available in Ball-Grid Array (BGA), FineLine® BGA (FBGA), Micro FineLine BGA® (MBGA), Ultra FineLine BGA (UBGA), Pin-Grid Array (PGA), Plastic J-Lead Chip Carrier (PLCC), Plastic Enhanced Quad Flat Pack (EQFP), Thin Quad Flat Pack (TQFP), Plastic Quad Flat Pack (PQFP), and Power Quad Flat Pack (RQFP). f For additional packaging information, refer to the Altera Device Packaging Data Sheet. Altera Corporation DS-CYTHRML-3.0 1 www.DataSheet.in Altera Device Package Information Data Sheet Cyclone III Devices Thermal resistance values for Cyclone III devices are provided for a board meeting JEDEC specifications and for a typical board. The JEDEC board specifications require two signals and two power/ground planes and are available at www.jedec.org. The values are described in Tables 1 through 4. Table 1. Thermal Resistance Val...