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MT9M012 Dataheets PDF



Part Number MT9M012
Manufacturers Aptina Imaging Corporation
Logo Aptina Imaging Corporation
Description 1.6Mp CMOS Digital Image Sensor Die
Datasheet MT9M012 DatasheetMT9M012 Datasheet (PDF)

MT9M012: 1.6Mp CMOS Digital Image Sensor Die Features www.DataSheet4U.com 1/4.5-Inch, 1.6Mp CMOS Digital Image Sensor Die MT9M012 For the product data sheet, refer to Aptina’s Web site: www.Aptina.com Features • • • • • • • • • • • • • • • • • • DigitalClarity CMOS imaging technology High frame rate (1280H x 720V/50 fps) Superior low-light performance Low dark current Global reset release (GRR) for simultaneous exposure of all rows Simple two-wire serial interface Programmable controls: gain, .

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MT9M012: 1.6Mp CMOS Digital Image Sensor Die Features www.DataSheet4U.com 1/4.5-Inch, 1.6Mp CMOS Digital Image Sensor Die MT9M012 For the product data sheet, refer to Aptina’s Web site: www.Aptina.com Features • • • • • • • • • • • • • • • • • • DigitalClarity CMOS imaging technology High frame rate (1280H x 720V/50 fps) Superior low-light performance Low dark current Global reset release (GRR) for simultaneous exposure of all rows Simple two-wire serial interface Programmable controls: gain, frame rate, frame size, exposure Horizontal and vertical mirror image Automatic black level calibration On-die phase-locked loop (PLL) oscillator Bulb exposure mode for arbitrary exposure times Snapshot mode to take frames on demand Parallel data output Electronic rolling shutter (ERS), progressive scan Arbitrary image decimation with anti-aliasing Programmable power-down mode (mode A or mode B) Xenon and LED flash support with fast exposure adaptation Flexible support for external auto focus, optical zoom, and mechanical shutter ® Die Database • Die outline, see Figure 2 on page 11 • Singulated die size – 6,748µm ±25µm x 6,351µm ±25µm • Bond Pad Identification Tables, see pages 5–10 Options • Form – Die • Testing – Standard (level 1) probe Product# Form Temp Chrom Designator D C1 Die database Testing level MT9M012D00STM Notes: 1. Consult die distributor or factory before ordering to verify long-term availability of these die products. Key Performance Parameters • Optical format: 1/4.5-inch (4:3) • Active imager size: 3.24mm(H) x 2.41mm(V), 4.04mm diagonal • Active pixels: 1472H x 1096V • Pixel size: 2.2µm x 2.2µm • Color filter array: monochrome • Shutter type – Global reset release (GRR), snapshot only – Electronic rolling shutter (ERS) • Maximum data rate: 82 Mp/s • Master clock: 41 MHz • Frame rate – 1440H x 1080V, programmable up to 30 fps – 1280H x 720V, programmable up to 50 fps • ADC resolution: 12-bit, on-die • Responsivity: 1.4 V/lux-sec (550nm) • Dynamic range: 70.1dB • SNR MAX: 38.1dB General Physical Specifications • Die thickness: 200µm ±12µm (Consult factory for other thickness) • Backside wafer surface of bare silicon • Typical metal 1 thickness: 3.1kÅ • Typical metal 2 thickness: 3.1kÅ • Typical metal 3 thickness: 6.1kÅ • Metallization composition: 99.5 percent Al and 0.5 percent Cu over Ti • Typical topside passivation: 2.2kÅ nitride over 6.0kÅ of undoped oxide • Passivation openings (MIN): 75µm x 90µm Order Information MT9M012D00STM PDF: 3518383133/Source: 6156369317 MT9M012_DDS - Rev. C; Pub. 5/10 EN 1 Aptina reserves the right to change products or specifications without notice. ©2008 Aptina Imaging Corporation All rights reserved. Products and specifications discussed herein are subject to change by Aptina without notice. Specifications discussed herein are subject to change without notice. This product is sold “as is” and is delivered with no guarantees or warranties, express or implied. MT9M012: 1.6Mp CMOS Digital Image Sensor Die Key Performance Parameters (continued) www.DataSheet4U.com Key Performance Parameters (continued) • Supply voltage – Digital: 1.7–1.9V – I/O: 2.6–3.1V – PLL: 2.6–3.1V – Analog: 2.6–3.1V • Power consumption: 364.6mW at 2.8V (parallel) • Operating temperature: –30°C to +70°C General Description The Aptina™ MT9M012 is a 1/4.5-inch format CMOS active-pixel digital image sensor die with a pixel array of 1472H x 1096V. The default active imaging array size is 1440H x 1080V. It incorporates sophisticated on-die camera functions such as windowing, mirroring, and snapshot mode. It is programmable through a simple two-wire serial interface and has very low power consumption. The MT9M012 digital image sensor die features DigitalClarity—the breakthrough lownoise CMOS imaging technology that achieves near-CCD image quality (based on signal-to-noise ratio and low-light sensitivity) while maintaining the inherent size, cost, and integration advantages of CMOS. Die Testing Procedures Aptina imager die products are tested with a standard probe (C1) test level. Wafer probe is performed at an elevated temperature to ensure product functionality in Aptina’s standard package. Because the package environment is not within Aptina’s control, the user must determine the necessary heat sink requirements to ensure that the die junction temperature remains within specified limits. Image quality is verified through various imaging tests. The probe functional test flow provides test coverage for the on-die ADC, logic, serial interface bus, and pixel array. Test conditions, margins, limits, and test sequence are determined by individual product yields and reliability data. Aptina retains a wafer map of each wafer as part of the probe records, along with a lot summary of wafer yields for each lot probed. Aptina reserves the right to change the probe program at any time to improve the reliability, packaged device yield, or performance of the product. Die users may experience differenc.


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