IC37 Series
Specifications
Dual Inline Package (DIP)
Part Number (Details)
Insulation Resistance: 1,000M W min. at 500V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistance: 20m W max. at 10mA /20mV max. Current Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS) Mating Cycles: 25,000 to 50,000 insertions
IC37N
Series No.
R B - 14 03 - G 4
Housing Material R =PPS Contact Plating: B = Mating Ter. 0.3µm Au
Solder Ter. 0.1µm Au
Materials and Finish
Housing: Polyphenylenesulfide (PPS), glass filled Contacts: Beryllium Copper (BeCu) Plating: Gold over Nickel
No. of Contact Pins
Features
í Dual wipe contacts ensure high reliability í Low costs due to selective gold plating í Applicable for IC packages and side braze packages í Ideal for automated burn-in
Row Space (03 = 0.3 inches) Gold Plating Straight, Through Hole Type
Outline Socket Dimensions
Recommended PC Board Layout
Top View from Socket
2.4
A B±0.05
0.36 -0.1
+0.2
B±0.1
1.8 3.2
H
.