Package. IC37NRB-4006-G4 Datasheet

IC37NRB-4006-G4 Datasheet PDF


Part

IC37NRB-4006-G4

Description

Dual Inline Package

Manufacture

Yamaichi Electronics

Page 1 Pages
Datasheet
Download IC37NRB-4006-G4 Datasheet


IC37NRB-4006-G4 Datasheet
IC37 Series
Dual Inline Package (DIP)
Specifications
Insulation Resistance:
1,000MW min. at 500V DC
Dielectric Withstanding Voltage: 700V AC for 1 minute
Contact Resistance:
20mW max. at 10mA /20mV max.
Current Rating:
1A max.
Operating Temperature Range: –40°C to +170°C (PPS)
Mating Cycles:
25,000 to 50,000 insertions
Materials and Finish
Housing: Polyphenylenesulfide (PPS), glass filled
Contacts: Beryllium Copper (BeCu)
Plating: Gold over Nickel
Features
í Dual wipe contacts ensure high reliability
í Low costs due to selective gold plating
í Applicable for IC packages and side braze packages
í Ideal for automated burn-in
Part Number (Details)
IC37N
Series No.
R B - 14 03 - G 4
Housing Material
R =PPS
Contact Plating:
B = Mating Ter. 0.3µm Au
Solder Ter. 0.1µm Au
No. of Contact Pins
Row Space (03 = 0.3 inches)
Gold Plating
Straight, Through Hole Type
Outline Socket Dimensions
A
2.4 B±0.05
H J±0.2
1.8
3.2
Recommended PC Board Layout
Top View from Socket
2.54±0.05
B±0.1
J±0.1
2.54±0.1
0.5 ±0.1
2- Æ3.2
1.5
4.0
Pin Count Æ0.9+00.1
2- Æ3.2
Part Number Pin Count
IC37NRB-1403-G4
IC37NRB-1404-G4
IC37NRB-1603-G4
IC37NRB-1803-G4
IC37NRB-2003-G4
IC37NRB-2004-G4
IC37NRB-2203-G4
IC37NRB-2204-G4
IC37NRB-2403-G4
wwwIICC.D3377atNNaRRShBBe--e22t44400U46.--cGGom44
IC37NRB-2803-G4
IC37NRB-2804-G4
IC37NRB-2806-G4
IC37NRB-3203-G4
IC37NRB-3206-G4
IC37NRB-3204-G4
IC37NRB-4006-G4
IC37NRB-4206-G4
IC37NRB-4806-G4
14
14
16
18
20
20
22
22
24
24
24
28
28
28
32
32
32
40
42
48
A
20.04
20.04
22.58
25.12
27.66
27.66
30.20
30.20
32.74
32.74
32.74
37.82
37.82
37.82
42.90
42.90
42.90
53.06
55.60
63.22
B
2.54 x 6 = 15.24
2.54 x 6 = 15.24
2.54 x 7 = 17.78
2.54 x 8 = 20.32
2.54 x 9 = 22.86
2.54 x 9 = 22.86
25.4 x 10 = 25.40
2.54 x 10 = 25.40
2.54 x 11 = 27.94
2.54 x 11 = 27.94
2.54 x 11 = 27.94
2.54 x 13 = 33.02
2.54 x 13 = 33.02
2.54 x 13 = 33.02
2.54 x 15 = 38.10
2.54 x 15 = 38.10
2.54 x 15 = 38.10
2.54 x 19 = 48.26
2.54 x 20 = 50.80
2.54 x 23 = 58.42
C
17.0
19.5
17.0
17.0
17.0
19.5
17.0
19.5
17.0
19.5
24.6
17.0
19.5
24.6
17.0
24.6
19.5
24.6
24.6
24.6
D
7.8
10.3
7.8
7.8
7.8
10.3
7.8
10.3
7.8
10.3
15.4
7.8
10.3
15.4
7.8
15.4
10.3
15.4
15.4
15.4
EF
2.0 7.5
2.9 8.0
2.0 7.5
2.0 7.5
2.0 7.5
2.9 8.0
2.0 7.5
2.9 8.0
2.0 7.5
2.9 8.0
8.0 10.3
2.0 7.5
2.9 8.0
8.0 10.3
2.0 7.5
8.0 10.3
2.9 8.0
8.0 10.3
8.0 10.3
8.0 10.3
G HJ
11.4
13.9
11.4
11.4
11.4
13.9
11.4
13.9
11.4
13.9
19.0
11.4
13.9
19.0
11.4
19.0
13.9
19.0
19.0
19.0
6.21
6.21
8.75
13.83
15.10
16.37
20.32
25.40
25.40
25.40
25.40
30.48
Test & Burn-In
SPECIFICATIONS ARE SUBJECT TO ALTERATION WITHOUT PRIOR NOTICE – DIMENSIONS IN MILLIMETER


Features Datasheet pdf IC37 Series Specifications Dual Inline Package (DIP) Part Number (Details) In sulation Resistance: 1,000M W min. at 5 00V DC Dielectric Withstanding Voltage: 700V AC for 1 minute Contact Resistanc e: 20m W max. at 10mA /20mV max. Curren t Rating: 1A max. Operating Temperature Range: –40°C to +170°C (PPS) Matin g Cycles: 25,000 to 50,000 insertions IC37N Series No. R B - 14 03 - G 4 Ho using Material R =PPS Contact Plating: B = Mating Ter. 0.3µm Au Solder Ter. 0 .1µm Au Materials and Finish Housing: Polyphenylenesulfide (PPS), glass fill ed Contacts: Beryllium Copper (BeCu) Pl ating: Gold over Nickel No. of Contact Pins Features í Dual wipe contacts e nsure high reliability í Low costs due to selective gold plating í Applicabl e for IC packages and side braze packag es í Ideal for automated burn-in Row Space (03 = 0.3 inches) Gold Plating St raight, Through Hole Type Outline Sock et Dimensions Recommended PC Board Lay out Top View from Socket 2.4 A B±0.05 0.36 -0.1 +0.2 B±0.1 1.8 3.2 H .
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