AWT6314R

AWT6314R Dual-band CDMA/PCS 3.4 V/28 dBm Linear Power Amplifier Module PRELIMINARY DATA SHEET - Rev 1.2 FEATURES Single Mode Operation: POUT ≤ +28 dBm High Efficiency: 54 % AMPS, 39 % CDMA Low Quiescent Current: 50 mA 25 % Package Size Reduction Common VMODE Control Line Simplified VCC Bus PCB routing Reduced External Component Count Low Profile Surface Mount Package: 1.1 mm RoHS Compliant Package, 250 oC MSL-3 AW T 631 4 APPLICATIONS Dual-band Cellular/PCS CDMA Wireless Handsets M23 Package 12 Pin 3 mm x 5 mm x 1 mm Surface Mount Module technology offering state-of-the-art reliability, temperature stability, and ruggedness. Selectable bias modes that optimize efficiency for different output power levels, and a shutdown mode with low leakage current, serve to increase handset talk and standby time. The self contained 3 mm x 5 mm x 1 mm surface mount package incorporates matching networks optimized for output power, efficiency and linearity in a 50 Ω system. GND at slug (pad) PRODUCT DESCRIPTION The AWT6314R meets the increasing demands for higher levels of integration in dual-band CDMA/PCS 1X handsets, while reducing board area requirements by 25 %. The package pinout was chosen to enable handset manufacturers to easily route VCC to both power amplifiers and simplify control with a common VMODE pin. The device is manufactured on an advanced InGaP HBT MMIC VREF_PCS 1 Bias Control 12 RFOUT_PCS RFIN_PCS 2 11 GND www.DataSheet4U.com VCC1 3 10 VCC...