Ultra High Performance BGA Cooling
Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-50290G-C2-R0
Features & Benefits
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m...
Description
Ultra High Performance BGA Cooling Solutions w/ maxiGRIP™ Attachment
ATS PART # ATS-50290G-C2-R0
Features & Benefits
»
maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling maxiGRIP™ attachment applies steady, even pressure to the component and does not require holes in the PCB Meets Telcordia GR-63-Core Office Vibration; ETSI 300 019 Transportation Vibration; and MIL-STD-810 Shock and Unpackaged Drop Testing standards Comes preassembled with high performance, phase changing, thermal interface material Designed for standard height components from 3 to 4.5mm
C
D
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B
A
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Thermal Performance
Air Velocity
*Image above is for illustration purposes only.
Thermal Resistance
FT/MIN
200 300 400 500 600 700 800
M/S
1.0 1.5 2.0 2.5 3.0 3.5 4.0
°C/W (UNDUCTED FLOW)
4.5 3.7 3.2 2.8 2.6 2.4 2.3
°C/W (DUCTED FLOW)
3.7
Product Details
DIMENSION A 29 mm
Notes:
2) 3) 4) 5) 6)
DIMENSION B 29 mm
DIMENSION C 12.5 mm
DIMENSION D 51.7 mm
INTERFACE MATERIAL Saint-gobain C1100F
FINISH BLUE-ANODIZED
1) Dimension C = heat sink height from bottom of the base to the top of the fin field. www.DataSheet4U.com
ATS-50290G-C1-R0 is a subsitute item available utilizing an equivalent phase change material (Chomerics T766). Thermal performance data are provided for reference only. Actual performance may vary by application. ATS reserves the right to update or change its products without notice to improve the desig...
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