HFB03

RoHS HFB03 & 05 Dimensions: HFB03 0.039±0.006 (0.99±0.15) 0.020±0.006 (0.51±0.15) 0.020±0.006 (0.51±0.15) High Frequency Ferrite Beads Inches (mm) HFB05 0.063±0.008 (1.60±0.20) 0.031±0.006 (0.79±0.15) 0.031±0.006 (0.79±0.15) 0.010±0.006 (0.25±0.15) 0.016 (0.41) 0.016±0.008 (0.41±0.20) 0.023 (0.58) 0.016 (0.41) 0.018 (0.46) 0.031 (0.79) 0.041 (1.04) Features Surface mount EMI suppression components Nickel barrier termination for excellent resistance to solder heat Offers Impedance performance at high frequencies Multi layer technology Flow and reflow soldering Allied Part Number HFB03-601-RC HFB03-102-RC HFB05-471-RC HFB05-601-RC Impedance (Ω) @ 100 MHz 25% 600 1000 Impedance (Ω) @ 1 GHz 40% HFB03 DC (Ω) Max. 0.7 1.1 0.7 0.8 1.5 1.6 Rated Current (mA) 300 250 200 200 100 100 1000 1400 HFB05 470 600 1000 600 700 1000 Electrical Impedance Range: HFB03 600 to 1000Ω HFB05 470 to 1500Ω Tolerance: 25% over entire range Operating Temp: -55ºC ~ +125ºC Storage Temp: Under 25ºC at 40~60% Humidity Rate Current: Based on temp rise not to exceed 30ºC 1200 HFB05-102-RC 1500 1500 HFB05-152-RC All specifications subject to change without notice. HFB03-601-RC HFB03-102-RC 2000 Resistance to Solder Heat Pre-Heat 150ºC, 1 minute Solder Composition: Sn/Ag3.0/Cu0.5 Solder Temp: 260±5ºC for 10sec ±1 sec. Minimum of 75% of Electrode covered with new solder. Impedance within 30% of initial value. Test Equipment (Z): HP4291A RF Impedance/Material Analyzer (RDC): Chen H...