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W2630 Dataheets PDF



Part Number W2630
Manufacturers Agilent(Hewlett-Packard)
Logo Agilent(Hewlett-Packard)
Description DDR2 BGA Probes
Datasheet W2630 DatasheetW2630 Datasheet (PDF)

W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes www.DataSheet4U.com Features The Agilent W2630 Series DDR2 BGA probes for logic analyzers and oscilloscopes enable viewing of data traffic on industry standard DDR2 DRAMs with the Agilent 16900 Series logic analysis system and Infiniium 80000 Series oscilloscopes. Fea.

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W2630 Series DDR2 BGA Probes for Logic Analyzers and Oscilloscopes Data Sheet The W2630 Series DDR2 BGA probes enable probing of embedded memory DIMMs directly at the ball grid array with Agilent logic analyzers and oscilloscopes www.DataSheet4U.com Features The Agilent W2630 Series DDR2 BGA probes for logic analyzers and oscilloscopes enable viewing of data traffic on industry standard DDR2 DRAMs with the Agilent 16900 Series logic analysis system and Infiniium 80000 Series oscilloscopes. Features Connects directly to the DDR2 BGA balls Supports: • x8 (84 ball) all signals • x16 (92 ball) all signals and x16 (84 ball) without mechanical support balls • x4 (60 ball) dual die packages with traces to CS0, CKE0, and OTD0 only • Quad die packages with W2632A and traces to CS0, CKE0 and ODT0 only Buried resistors provide signal isolation and minimize capacitive loading. Probe loading: 2 pF Minimum signal amplitude: • 250 mV p-p for single-ended signals • Vmax – Vmin 100 mV for differential signals • Operating transfer rate of 800 Mb/s • 2 GHz bandwidth Works with existing designs Supports either leaded or lead-free solder Benefits Eliminates reflections from mid-bus probing methods. Also eliminates board space and trace routing required for connector probing methods. Get complete signal access to the DDR2 signals critical to your debug and validation effort Acquire high-speed signals without impacting the performance of your design. The DDR2 BGA probe provides a non-intrusive electrical and mechanical connection between the memory device and an Agilent 16900 Series logic analyzer. Operate at full speed whether you’re making measurements with a logic analyzer or oscilloscope. Eliminates need for re-design or up front planning. Easily works with all solder finishes. Designed to tolerate lead-free soldering temperature profiles. Contract manufactures available for Eliminates the need to develop BGA soldering those without the in-house expertise expertise. or facilities for soldering BGAs Flexible “wings” with ZIF connectors Ensures reliable connection to the ZIF probes. Enables placement of the probe cables around adjacent components. Minimizes the torque to the balls of the BGA. Attach to E5384A, E5826A, or E5827A single-ended ZIF probes for connection to the logic analyzer Probe points available for soldering ZIF tip accessories to the scope probe adapter board that connects to the BGA probe Optimizes the use of logic analyzer channels by allowing assignment of channels to 8 or 16 bits on each DRAM. Enables oscilloscope probing of the DRAM signals with an Agilent Infiniium 80000 Series oscilloscope, giving you a DDR2 test solution covering the clock characterization, electrical and timing parameters of the JEDEC specification. www.DataSheet4U.com 2 DDR2 BGA Probe Connection to an Agilent Logic Analyzer The W2630 Series DDR2 BGA probes are used with the 46 channel singleended ZIF probe which connects to 90-pin logic analyzer cable. The BGA probe has.


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