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CY7C1318AV18

Cypress Semiconductor

18-Mbit DDR-II SRAM 2-Word Burst Architecture

CY7C1316AV18 CY7C1318AV18 CY7C1320AV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture Features • 18-Mb density (2M x 8, ...


Cypress Semiconductor

CY7C1318AV18

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Description
CY7C1316AV18 CY7C1318AV18 CY7C1320AV18 18-Mbit DDR-II SRAM 2-Word Burst Architecture Features 18-Mb density (2M x 8, 1M x 18, 512K x 36) 250-MHz clock for high bandwidth 2-Word burst for reducing address bus frequency Double Data Rate (DDR) interfaces (data transferred at 500 MHz) @ 250 MHz Two input clocks (K and K) for precise DDR timing — SRAM uses rising edges only Two output clocks (C and C) account for clock skew and flight time mismatching Echo clocks (CQ and CQ) simplify data capture in high-speed systems Synchronous internally self-timed writes 1.8V core power supply with HSTL inputs and outputs Variable drive HSTL output buffers Expanded HSTL output voltage (1.4V–VDD) 13 x 15 x 1.4 mm 1.0-mm pitch fBGA package, 165 ball (11x15 matrix) JTAG 1149.1 compatible test access port Delay Lock Loop (DLL) for accurate data placement Functional Description The CY7C1316AV18/CY7C1318AV18/CY7C1320AV18 are 1.8V Synchronous Pipelined SRAM equipped with DDR-II architecture. The DDR-II consists of an SRAM core with advanced synchronous peripheral circuitry and a 1-bit burst counter. Addresses for Read and Write are latched on alternate rising edges of the input (K) clock. Write data is registered on the rising edges of both K and K. Read data is driven on the rising edges of C and C if provided, or on the rising edge of K and K if C/C are not provided. Each address location is associated with two 8-bit words in the case of CY7C1316AV18 that burst sequent...




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