TrenchT2 GigaMOS HiperFET Power MOSFET
Advance Technical Information
TrenchT2TM GigaMOSTM HiperFETTM Power MOSFET
(Electrically Isolated Tab) N-Channel Enhanc...
Description
Advance Technical Information
TrenchT2TM GigaMOSTM HiperFETTM Power MOSFET
(Electrically Isolated Tab) N-Channel Enhancement Mode Avalanche Rated Fast Intrinsic Diode
Symbol VDSS VDGR VGSS VGSM ID25 IDM IA EAS PD TJ TJM Tstg VISOL TL TSOLD VISOL FC Weight
www.DataSheet4U.net
IXFZ520N075T2
VDSS ID25
= =
RDS(on) ≤
75V 465A 1.3mΩ
DE475
D
D
D
Test Conditions TJ = 25°C to 175°C TJ = 25°C to 175°C, RGS = 1MΩ Continuous Transient TC = 25°C TC = 25°C, Pulse Width Limited by TJM TC = 25°C TC = 25°C TC = 25°C
Maximum Ratings 75 75 ±20 ±30 465 1560 200 3 600 -55 ... +175 175 -55 ... +175 V V V V A A A J W °C °C °C V~ V~ °C °C V~ N/lb. g
G S S
Isolated Tab
G = Gate S = Source
D = Drain
Features
z
50/60 Hz, RMS IISOL ≤ 1mA
t = 1 minute t = 1 second
2500 3000 300 260 2500 20..120 / 4.5..27 3
1.6mm (0.062 in.) from Case for 10s Plastic Body for 10s 50/60 Hz, 1 Minute Mounting Force
Silicon Chip on Direct-Copper Bond (DCB) Substrate z Isolated Substrate - Excellent Thermal Transfer - Increased Temperature and Power Cycling Capability - High Isolation Voltage (2500V~) z 175°C Operating Temperature z Very High Current Handling Capability z Fast Intrinsic Diode z Avalanche Rated z Very Low RDS(on) Advantages
Symbol Test Conditions (TJ = 25°C, Unless Otherwise Specified) BVDSS VGS(th) IGSS IDSS RDS(on) VGS = 0V, ID = 3mA VDS = VGS, ID = 8mA VGS = ±20V, VDS = 0V VDS = VDSS, VGS = 0V TJ = 150°C
Characteristic Values Min. Typ. Max. 75 2.0 4.0 ±200 V V nA
z z z
Easy to Mount...
Similar Datasheet