PROCESS
CPD82X
Schottky Diode
High Current, Low VF Schottky Diode Chip
www.DataSheet4U.com
PROCESS DETAILS Process D...
PROCESS
CPD82X
Schottky Diode
High Current, Low VF
Schottky Diode Chip
www.DataSheet4U.com
PROCESS DETAILS Process Die Size Die Thickness Anode Bonding pad Area Top Side Metalization Back Side Metalization EPITAXIAL PLANAR 14.6 x 14.6 MILS 5.5 MILS 11.8 x 11.8 MILS Al - 30,000Å Au - 12,000Å
GEOMETRY GROSS DIE PER 5 INCH WAFER 80,282 PRINCIPAL DEVICE TYPES CMDSH2-3 CMDSH2-4L CMOSH2-4L CMUSH2-4L CMKSH2-4L CMXSH2-4L
R2 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
PROCESS
CPD82X
Typical Electrical Characteristics
R2 (22-March 2010)
w w w. c e n t r a l s e m i . c o m
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