MB1608301Y5x

SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 1 MULTILAYER CHIP BEAD CONFIGURATION & DIMENSIONS ¡G A ABC'S DWG NO. ABC'S ITEM NO. MB1608□□□□5□ ¢¹¡O www.DataSheet4U.com D D C B I G PCB Pattern I Unit : m/m Series MB1608 A 1.60±0.15 B 0.80±0.15 C 0.80±0.15 D 0.30±0.20 G 0.7 H 0.7 H I 0.7 ¢º¡O SCHEMATIC DIAGRAM ¡G ¢»¡O MATERIALS ¡G a¡ b¡ c¡ d¡ Body O Ferrite ¡ G G Internal conductor O Silver or Ag / Pd ¡ Remark O Lead¡ content G 1600ppm typ. include ferrite a b c Terminal electrode O Ag/Ni/Sn (Lead¡ contant 100ppm max.) G ¢¼¡O GENERAL SPECIFICATION ¡G a¡ b¡ c¡ Storage temp. O -40 ---- +105 ¡ ¡ F Type MB1608 d¡ Solderability O F ( kgf ) 0.5 time ( sec ) Temperature ( ¢J 250 50sec max. G ¢ G Peak Temp¡ J J Operating temp. O -25 ---- +85 ¡ Terminal Strength O 260 G ¢ max. ¢ J Max time above 230¢ J ¡ G 50sec max. Max G time above 200¢ J ¡ G 70sec max. Temperature Rising Area +4.0¢J / sec max. Preheat Area 150 ~ 200¢J / 60 ~ 120sec Reflow Area +2.0 ~ 4.0¢J / sec max. Forced Cooling Area -(1.0 ~ 5.0)¢J / sec max. Peak Temperature: 260¢J 230¢J 30±5 200 150 70sec max. ¡ G Solder : Sn96.5 / Ag3 / Cu0.5 or equivalent Solder temp. : 260±5¢J Flux : Rosin Dip time : 4±1 seconds ) 100 50 0 50 100 150 Time ( seconds ) 200 250 AE-001A SPECIFICATION FOR APPROVAL REF : PROD. NAME PAGE: 2 MULTILAYER CHIP BEAD ELECTRICAL CHARACTERISTICS ¡G DWG No. MB1608100Y5□ MB1608300Y5□ MB1608600Y5□ MB1608121Y5□ MB1608221Y5□ MB1608301Y5□ Impedance (Ω) 10.0...