Document
Freescale Semiconductor Data Sheet: Technical Data
Document Number MCF51QU128 Rev. 5, 03/2015
MCF51QU128
Supports the MCF51QU128VLH, MCF51QU128VHS, MCF51QU64VLF, MCF51QU64VHS, MCF51QU32VHS, MCF51QU32VFM
Features
• Operating characteristics – Voltage range: 1.71 V to 3.6 V – Flash write voltage range: 1.71 V to 3.6 V – Temperature range (ambient): -40°C to 105°C
• Core – Up to 50 MHz V1 ColdFire CPU – Dhrystone 2.1 performance: 1.10 DMIPS per MHz when executing from internal RAM, 0.99 DMIPS per MHz when executing from flash memory
• System – DMA controller with four programmable channels – Integrated ColdFire DEBUG_Rev_B+ interface with single-wire BDM connection
• Power management – 10 low power modes to provide power optimization based on application requirements – Low-leakage wakeup unit (LLWU) – Voltage regulator (VREG)
• Clocks – Crystal oscillators (two, each with range options): 1 kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 MHz to 32 MHz (high) – Multipurpose clock generator (MCG)
• Memories and memory interfaces – Flash memory, FlexNVM, FlexRAM, and RAM – Serial programming interface (EzPort) – Mini-FlexBus external bus interface
MCF51QU128
• Security and integrity – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip
• Analog – 12-bit SAR ADC – 12-bit DAC – Analog comparator (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference (VREF)
• Timers – Programmable delay block (PDB) – Motor control/general purpose/PWM timers (FTM) – 16-bit low-power timers (LPTMRs) – 16-bit modulo timer (MTIM) – Carrier modulator transmitter (CMT)
• Communication interfaces – UARTs with Smart Card support and FIFO – SPI modules, one with FIFO – Inter-Integrated Circuit (I2C) modules
• Human-machine interface – Up to 48 EGPIO pins – Up to 16 rapid general purpose I/O (RGPIO) pins – Low-power hardware touch sensor interface (TSI) – Interrupt request pin (IRQ)
© 2010–2015 Freescale Semiconductor, Inc.
Table of Contents
1 Ordering parts.......................................................................................3
5.4 Thermal specifications................................................................. 20
1.1 Determining valid orderable parts............................................... 3
5.4.1 Thermal operating requirements.................................... 20
2 Part identification................................................................................. 3
5.4.2 Thermal attributes.......................................................... 20
2.1 Description...................................................................................3
6 Peripheral operating requirements and behaviors................................ 21
2.2 Format.......................................................................................... 3
6.1 Core modules............................................................................... 21
2.3 Fields............................................................................................3
6.1.1 Debug specifications...................................................... 21
2.4 Example....................................................................................... 4
6.2 System modules........................................................................... 21
3 Terminology and guidelines.................................................................4
6.2.1 VREG electrical specifications...................................... 21
3.1 Definition: Operating requirement...............................................4
6.3 Clock modules............................................................................. 22
3.2 Definition: Operating behavior.................................................... 4
6.3.1 MCG specifications........................................................22
3.3 Definition: Attribute.................................................................... 5
6.3.2 Oscillator electrical specifications................................. 24
3.4 Definition: Rating........................................................................ 5
6.4 Memories and memory interfaces................................................26
3.5 Result of exceeding a rating.........................................................6
6.4.1 Flash electrical specifications........................................ 26
3.6 Relationship between ratings and operating requirements.......... 6
6.4.2 EzPort Switching Specifications.................................... 29
3.7 Guidelines for ratings and operating requirements......................6
6.4.3 Mini-Flexbus Switching Specifications......................... 30
3.8 Definition: Typical value............................................................. 7
6.5 Security and integrity modules.................................................... 33
4 Ratings............................................................