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MCF51QU128 Dataheets PDF



Part Number MCF51QU128
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description Microcontrollers
Datasheet MCF51QU128 DatasheetMCF51QU128 Datasheet (PDF)

Freescale Semiconductor Data Sheet: Technical Data Document Number MCF51QU128 Rev. 5, 03/2015 MCF51QU128 Supports the MCF51QU128VLH, MCF51QU128VHS, MCF51QU64VLF, MCF51QU64VHS, MCF51QU32VHS, MCF51QU32VFM Features • Operating characteristics – Voltage range: 1.71 V to 3.6 V – Flash write voltage range: 1.71 V to 3.6 V – Temperature range (ambient): -40°C to 105°C • Core – Up to 50 MHz V1 ColdFire CPU – Dhrystone 2.1 performance: 1.10 DMIPS per MHz when executing from internal RAM, 0.99 DMIPS per.

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Freescale Semiconductor Data Sheet: Technical Data Document Number MCF51QU128 Rev. 5, 03/2015 MCF51QU128 Supports the MCF51QU128VLH, MCF51QU128VHS, MCF51QU64VLF, MCF51QU64VHS, MCF51QU32VHS, MCF51QU32VFM Features • Operating characteristics – Voltage range: 1.71 V to 3.6 V – Flash write voltage range: 1.71 V to 3.6 V – Temperature range (ambient): -40°C to 105°C • Core – Up to 50 MHz V1 ColdFire CPU – Dhrystone 2.1 performance: 1.10 DMIPS per MHz when executing from internal RAM, 0.99 DMIPS per MHz when executing from flash memory • System – DMA controller with four programmable channels – Integrated ColdFire DEBUG_Rev_B+ interface with single-wire BDM connection • Power management – 10 low power modes to provide power optimization based on application requirements – Low-leakage wakeup unit (LLWU) – Voltage regulator (VREG) • Clocks – Crystal oscillators (two, each with range options): 1 kHz to 32 kHz (low), 1 MHz to 8 MHz (medium), 8 MHz to 32 MHz (high) – Multipurpose clock generator (MCG) • Memories and memory interfaces – Flash memory, FlexNVM, FlexRAM, and RAM – Serial programming interface (EzPort) – Mini-FlexBus external bus interface MCF51QU128 • Security and integrity – Hardware CRC module to support fast cyclic redundancy checks – 128-bit unique identification (ID) number per chip • Analog – 12-bit SAR ADC – 12-bit DAC – Analog comparator (CMP) containing a 6-bit DAC and programmable reference input – Voltage reference (VREF) • Timers – Programmable delay block (PDB) – Motor control/general purpose/PWM timers (FTM) – 16-bit low-power timers (LPTMRs) – 16-bit modulo timer (MTIM) – Carrier modulator transmitter (CMT) • Communication interfaces – UARTs with Smart Card support and FIFO – SPI modules, one with FIFO – Inter-Integrated Circuit (I2C) modules • Human-machine interface – Up to 48 EGPIO pins – Up to 16 rapid general purpose I/O (RGPIO) pins – Low-power hardware touch sensor interface (TSI) – Interrupt request pin (IRQ) © 2010–2015 Freescale Semiconductor, Inc. Table of Contents 1 Ordering parts.......................................................................................3 5.4 Thermal specifications................................................................. 20 1.1 Determining valid orderable parts............................................... 3 5.4.1 Thermal operating requirements.................................... 20 2 Part identification................................................................................. 3 5.4.2 Thermal attributes.......................................................... 20 2.1 Description...................................................................................3 6 Peripheral operating requirements and behaviors................................ 21 2.2 Format.......................................................................................... 3 6.1 Core modules............................................................................... 21 2.3 Fields............................................................................................3 6.1.1 Debug specifications...................................................... 21 2.4 Example....................................................................................... 4 6.2 System modules........................................................................... 21 3 Terminology and guidelines.................................................................4 6.2.1 VREG electrical specifications...................................... 21 3.1 Definition: Operating requirement...............................................4 6.3 Clock modules............................................................................. 22 3.2 Definition: Operating behavior.................................................... 4 6.3.1 MCG specifications........................................................22 3.3 Definition: Attribute.................................................................... 5 6.3.2 Oscillator electrical specifications................................. 24 3.4 Definition: Rating........................................................................ 5 6.4 Memories and memory interfaces................................................26 3.5 Result of exceeding a rating.........................................................6 6.4.1 Flash electrical specifications........................................ 26 3.6 Relationship between ratings and operating requirements.......... 6 6.4.2 EzPort Switching Specifications.................................... 29 3.7 Guidelines for ratings and operating requirements......................6 6.4.3 Mini-Flexbus Switching Specifications......................... 30 3.8 Definition: Typical value............................................................. 7 6.5 Security and integrity modules.................................................... 33 4 Ratings............................................................


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