Freescale Semiconductor Advance Information
Document Number: MM912_634D1 Rev. 4.0, 5/2011
Integrated S12 Based Relay D...
Freescale Semiconductor Advance Information
Document Number: MM912_634D1 Rev. 4.0, 5/2011
Integrated S12 Based Relay Driver with LIN
The MM912G634 (48 kB) and MM912H634 (64 kB) are integrated single package solutions that integrates an HCS12 microcontroller with a SMARTMOS analog control IC. The Die to Die Interface (D2D) controlled analog die combines system base chip and application specific functions, including a LIN transceiver. Features 16-Bit S12 CPU, 64/48 kByte P-FLASH, 6.0 kByte RAM; 4/2 kByte D-FLASH Background debug (BDM) & debug module (DBG) Die to Die bus interface for transparent memory mapping On-chip oscillator & two independent watchdogs www.DataSheet4U.net LIN 2.1 Physical Layer Interface with integrated SCI 10 digital MCU GPIOs shared with SPI (PA7…0, PE1…0) 10-Bit, 15 Channel - Analog to Digital Converter (ADC) 16-Bit, 4 Channel - Timer Module (TIM16B4C) 8-Bit, 2 Channel - Pulse width modulation module (PWM)
MM912_634
48-PIN LQFP, 7.0 mm x 7.0 mm AE SUFFIX: Exposed Pad Option AP SUFFIX: Non Exposed Pad Option ORDERING INFORMATION
See Page 2.
Six high voltage / Wake-up inputs (L5…0) Three low voltage GPIOs (PB2…0) Low power modes with cyclic sense & forced wake-up Current sense module with selectable gain Reverse battery protected voltage sense module Two protected low side outputs to drive inductive loads Two protected high side outputs Chip temperature sensor Hall sensor supply & integrated voltage
regulator(s)
Ba...
