MOSFET
Analog Power N & P-Channel 20-V (D-S) MOSFET
These miniature surface mount MOSFETs utilize a high cell density trench pr...
Description
Analog Power N & P-Channel 20-V (D-S) MOSFET
These miniature surface mount MOSFETs utilize a high cell density trench process to provide low rDS(on) and to ensure minimal power loss and heat dissipation. Typical applications are DC-DC converters and power management in portable and battery-powered products such as computers, printers, PCMCIA cards, cellular and cordless telephones.
Low rDS(on) provides higher efficiency and extends battery life Low thermal impedance copper leadframe DFN2X3 saves board space Fast switching speed High performance trench technology
S1 G1 S2 G2 1 2 3 4
AM5521C
PRODUCT SUMMARY VDS (V) rDS(on) (Ω) 20 -20
DFN2x3 Top View 8 7 6 5 D1 D1 D2 D2
ID (A) 5 4.3 -4.7 -4.1
S2 G2
0.058 @ VGS = 4.5V 0.077 @ VGS = 2.5V 0.064 @ VGS = -4.5V 0.085 @ VGS = -2.5V
D1
G1
D2 S1 N-Channel MOSFET P-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS (TA = 25 oC UNLESS OTHERWISE NOTED) Parameter Symbol N-Channel P-Channel Units Drain-Source Voltage VDS 20 -20 V VGS Gate-Source Voltage ±8 ±8
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Continuous Drain Current Pulsed Drain Current
b
a
TA=25 C TA=70 C
o
o
ID IDM
5 4.1 8 4.5 2.1
1.3
-4.7 -3.9 -8 -4.5 A W
o
A
Continuous Source Current (Diode Conduction) Power Dissipation
a
a o o
IS PD TJ, Tstg
TA=25 C TA=70 C
Operating Junction and Storage Temperature Range
-55 to 150
C
THERMAL RESISTANCE RATINGS Parameter
Maximum Junction-to-Ambient
a
Symbol
t <= 10 sec Steady State RθJA
Maximum 62.5 80
Units
o o
C/W C/W
Notes a. Surface Mounte...
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