Multilayer Power Chip Inductors
PL IA NT
Features
■ Monolithic construction offering high ■ ■ ■ ■
Applications
■ DC/DC converters for:
CO M
reliabil...
Description
PL IA NT
Features
■ Monolithic construction offering high ■ ■ ■ ■
Applications
■ DC/DC converters for:
CO M
reliability Magnetically shielded construction providing low radiation Low DC resistance Low profile RoHS compliant*
- Smart phones - DVCs / DSCs - Tablets - HDDs / SSDs - Mobile electronic devices
*R oH S
CVH252009 Series Multilayer Power Chip Inductors
Electrical Specifications
Inductance @ 1 MHz L (µH) CVH252009-R47M CVH252009-1R0M CVH252009-1R5M CVH252009-2R2M CVH252009-3R3M CVH252009-4R7M 0.47 1.0 1.5 2.2 3.3 4.7 Tol. ±20 % ±20 % ±20 % ±20 % ±20 % ±20 % SRF (MHz) Typ. 100 60 50 40 30 25 DCR (Ohms) Max. 0.04 0.055 0.07 0.08 0.10 0.11 1800 1600 1500 1300 1200 1100 IDC (mA)
General Specifications Operating Temperature ................................-55 °C to +125 °C (Temperature rise included) Storage Temperature .....................+40 °C max. at 70 % RH Resistance to Soldering Heat ...............................................+260 °C Temperature Rise ......................... 40 °C at rated current Materials Core ..............................................Ferrite Terminal ......................................... Ni/Sn Packaging ....... 3000 pcs. per 7 inch reel
SOLDERING
Bourns® Part No.
Soldering Profile (Lead Free Solder)
PRE-HEATING
Product Dimensions
FERRITE TERMINAL ELECTRODE
260
Temperature (°C)
217 200
www.DataSheet.net/
0.5 ± 0.3 (.020 ± .012)
150
2.5 ± 0.2 (.098 ± .008)
0.5 ± 0.3 (.020 ± .012)
25
60~120 SECONDS ≥30 SECONDS 60~150 SE...
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