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TQP6M9017

TriQuint Semiconductor

Dual-Band WLAN Module

TQP6M9017 Preliminary Data Sheet 802.11a/b/g/n WLAN/BT High Performance Front-End Module Functional Block Diagram Featu...


TriQuint Semiconductor

TQP6M9017

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TQP6M9017 Preliminary Data Sheet 802.11a/b/g/n WLAN/BT High Performance Front-End Module Functional Block Diagram Features      Fully Integrated, 802.11a/b/g/n + BT high performance front-end module. Internally matched input/output Integrated directional detectors Temperature Compensated Bias Network Typical Pout = 23.5dBm 802.11b, 19.0dBm 802.11g 54Mbps 64QAM at 3.5% EVM, 18.0dBm 802.11n MCS7 64QAM at 2.8% EVM Typical Pout = 20.0dBm 802.11a 54Mbps 64QAM at 3.5% EVM, 19.0dBm 802.11n MCS7 64QAM at 2.4% EVM 2.4GHz WLAN RX, Gain = 4.0dB , NF = 3.0dB 2.4GHz BT+WLAN Simultaneous RX, Gain = 2.5dB, NF = 3.0dB 5GHz LNA with Gain = 12dB, NF = 3.0dB Single battery Vcc voltage of 3.0V nom. Leadless 4.0 x 4.0 x 0.5 mm SMT Pb-Free   Product Description www.DataSheet.net/     The TQP6M9017 is full WLAN/BT front-end module in an ultra small 4mm x 4mm footprint package for 802.11a/b/g/n and Bluetooth applications. The TQP6M9017 contains 2.4GHz PA, 5GHz PA, directional detectors, front-end switch, Bluetooth path, and receive LNA + baluns. The architecture and interface are optimized for next generation WLAN integration into handset devices. The front-end module features CMOS compatible control voltages to facilitate ease of use. The front-end module is manufactured in TriQuint’s high reliability E/D pHEMT and HBT technologies and is assembled in thin profile 4mm x 4mm x 0.5mm ETSLP-24 Pb-Free package. Applications     IEEE802.11a/b/g/n WLAN/BT Applications Single-Chip RF ...




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