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M81723FP Dataheets PDF



Part Number M81723FP
Manufacturers Mitsubishi Electric Semiconductor
Logo Mitsubishi Electric Semiconductor
Description HIGH VOLTAGE HALF BRIDGE DRIVER
Datasheet M81723FP DatasheetM81723FP Datasheet (PDF)

MITSUBISHI SEMICONDUCTORS M81723FP HIGH VOLTAGE HALF BRIDGE DRIVER DESCRIPTION M81723FP is high voltage Power MOSFET and IGBT module driver for half bridge applications. PIN CONFIGURATION (TOP VIEW) FEATURES ¡FLOATING SUPPLY VOLTAGE ... 600V ¡OUTPUT CURRENT .. +130mA/–100mA (typ) ¡UNDERVOLTAGE LOCKOUT ¡SOP-16 PACKAGE APPLICATIONS IGBT/MOSFET driver LO Vcom VCC2 NC NC VS VB HO 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC GND LIN NC HIN .

  M81723FP   M81723FP



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MITSUBISHI SEMICONDUCTORS M81723FP HIGH VOLTAGE HALF BRIDGE DRIVER DESCRIPTION M81723FP is high voltage Power MOSFET and IGBT module driver for half bridge applications. PIN CONFIGURATION (TOP VIEW) FEATURES ¡FLOATING SUPPLY VOLTAGE ................................. 600V ¡OUTPUT CURRENT ...................... +130mA/–100mA (typ) ¡UNDERVOLTAGE LOCKOUT ¡SOP-16 PACKAGE APPLICATIONS IGBT/MOSFET driver LO Vcom VCC2 NC NC VS VB HO 1 2 3 4 5 6 7 8 16 15 14 13 12 11 10 9 NC GND LIN NC HIN VCC NC NC NC:NO CONNECTION Outline:16P2N BLOCK DIAGRAM www.DataSheet.net/ VCC 11 7 VB VREG HV LEVEL SHIFT VREG/VCC LEVEL SHIFT Ponr UV DETECT INTER LOCK RQ S 8 HO HIN 12 PULSE GEN 6 3 VS VCC2 HV LEVEL SHIFT VREG/VCC LEVEL SHIFT Ponr UV DETECT INTER LOCK RQ S 1 LO LIN 14 PULSE GEN 2 Vcom GND 15 Aug. 2009 1 Datasheet pdf - http://www.DataSheet4U.co.kr/ MITSUBISHI SEMICONDUCTORS M81723FP HIGH VOLTAGE HALF BRIDGE DRIVER ABSOLUTE MAXIMUM RATINGS (Ta = 25°C unless otherwise specified) Symbol VB VS VBS VHO VCC2 Vcom VCC2com VLO VCC VIN dVS/dt Pd Kq Rth(j-c) Tj Topr Tstg TL Parameter High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Supply Voltage High Side Output Voltage Low Side Floating Supply Absolute Voltage Output Standard Voltage Low Side Floating Supply Voltage Low Side Output Voltage Low Side Fixed Supply Voltage Logic Input Voltage Allowable Offset Voltage Transient Package Power Dissipation Linear Derating Factor Junction-Case Thermal Resistance Junction Temperature Operation Temperature Storage Temperature Solder Heat-proof (Reflow) Test conditions Ratings –0.5 ~ 624 VB–24 ~ VB+0.5 VBS = VB–VS –0.5 ~ 24 VS–0.5 ~ VB+0.5 –0.5 ~ 624 VCC2–24 ~ VCC2+0.5 –0.5 ~ 24 Vcom–0.5 ~ VCC2+0.5 –0.5 ~ 24 –0.5 ~ VCC+0.5 ±50 0.11 –8.9 45 –40 ~ 125* –40 ~ 100 –55 ~ 150 Pb Free 255:10s, max 260 Unit V V V V V V V V V V V/ns W mW/°C °C/W °C °C °C °C VCC2com = VCC2–Vcom HIN, LIN Ta = 25°C, On Board Ta > 25°C, On Board * Please adjust the VS potential to 500V or less when the junction temperature (Tj) exceeds 125°C. RECOMMENDED OPERATING CONDITIONS Symbol VB VS VBS VHO VCC2 Vcom VCC2com VLO VCC VIN Parameter High Side Floating Supply Absolute Voltage High Side Floating Supply Offset Voltage High Side Floating Supply Voltage High Side Output Voltage Low Side Floating Supply Absolute Voltage Output Standard Voltage Low Side Floating Supply Voltage Low Side Output Voltage Low Side Fixed Supply Voltage Logic Input Voltage Test conditions www.DataSheet.net/ VB > 10V VBS = VB–VS Min. VS+10 –5 10 VS Vcom+10 –5 10 Vcom 10 0 Limits Typ. — — — — — — — — — — Max. VS+20 500 20 VB Vcom+20 500 20 VCC2 20 VCC Unit V V V V V V V V V V VCC2 > 10V VCC2com = VCC2–Vcom HIN, LIN * For proper operation, the device should be used within the recommended conditions. THERMAL DERATING FACTOR CHARACTERISTIC (MAXIMUM RATING) 2.0 Package Power Dissipation Pd (W) 1.5 1.0 0.5 0 0 25 50 75 100 1.


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