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PS21962-4W Dataheets PDF



Part Number PS21962-4W
Manufacturers Mitsubishi Electric Semiconductor
Logo Mitsubishi Electric Semiconductor
Description Dual-In-Line Intelligent Power Module
Datasheet PS21962-4W DatasheetPS21962-4W Datasheet (PDF)

MITSUBISHI SEMICONDUCTOR PS21962-4/-4A/-4C/-4W TRANSFER-MOLD TYPE INSULATED TYPE PS21962-4 INTEGRATED POWER FUNCTIONS 600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS • • • • • For upper-leg IGBTS :Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection. For lower-leg IGBTS : Drive circuit, Control .

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MITSUBISHI SEMICONDUCTOR PS21962-4/-4A/-4C/-4W TRANSFER-MOLD TYPE INSULATED TYPE PS21962-4 INTEGRATED POWER FUNCTIONS 600V/5A low-loss 5th generation IGBT inverter bridge for three phase DC-to-AC power conversion INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS • • • • • For upper-leg IGBTS :Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection. For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC). Fault signaling : Corresponding to an SC fault (Lower-leg IGBT) or a UV fault (Lower-side supply). Input interface : 3V, 5V line (High Active). UL Approved : Yellow Card No. E80276 APPLICATION AC100V~200V three-phase inverter drive for small power motor control. Fig. 1 PACKAGE OUTLINES (PS21962-4) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A www.DataSheet.net/ Dimensions in mm B TERMINAL CODE 3.5 0.28 1.778 ±0.2 16-0.5 1.5 ±0.05 17 1 14.4 ±0.5 .6 R1 2- QR Code 3 MIN Type name Lot No. 0.8 HEAT SINK SIDE 18 0.28 2.54 ±0.2 14×2.54 (=35.56) 0.5 0.5 0.5 25 8-0.6 4-C1.2 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC (1) 14.4 ±0.5 0.4 12 29.2 ±0.5 24 ±0.5 (3.5) (3.3) 2.5 MIN 0.5 (2.656) (0~5°) 0.4 1.5 M IN 9.5±0.5 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) DETAIL B *) Two VNC terminals (9 & 16 pin) are connected inside DIP-IPM, please connect either one to the 15V power supply GND outside and leave another one open. Aug. 2007 Datasheet pdf - http://www.DataSheet4U.co.kr/ MITSUBISHI SEMICONDUCTOR PS21962-4/-4A/-4C/-4W TRANSFER-MOLD TYPE INSULATED TYPE Fig. 2 LONG TERMINAL TYPE PACKAGE OUTLINES (PS21962-4A) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A B Dimensions in mm TERMINAL CODE 3.5 16-0.5 (1) 0.28 1.778 ±0.2 1.5 ±0.05 0.4 17 1 14.4 ±0.5 .6 R1 2- QR Code 3 MIN Type name Lot No. 0.8 HEAT SINK SIDE 18 0.28 ± 2.54 0.2 25 8-0.6 14×2.54 (=35.56) 0.5 0.5 0.5 (2.656) 14±0.5 4-C1.2 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC 14.4 ±0.5 12 29.4 ±0.5 24 ±0.5 (3.5) (3.3) 0.5 2.5 MIN (0~5°) 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) *) Two VNC terminals (9 & 16 pin) are connected inside DIP-IPM, please connect either one to the 15V power supply GND outside and leave another one open. www.DataSheet.net/ Fig. 3 ZIGZAG TERMINAL TYPE PACKAGE OUTLINES (PS21962-4C) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A B 3.5 1.5 ±0.05 0.4 0.4 1.5 M IN DETAIL B Dimensions in mm TERMINAL CODE 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N.


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