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PS21963-ET Dataheets PDF



Part Number PS21963-ET
Manufacturers Mitsubishi Electric Semiconductor
Logo Mitsubishi Electric Semiconductor
Description Dual-In-Line Package Intelligent Power Module
Datasheet PS21963-ET DatasheetPS21963-ET Datasheet (PDF)

MITSUBISHI SEMICONDUCTOR PS21963-ET/-AET/-CET/-ETW TRANSFER-MOLD TYPE INSULATED TYPE PS21963-ET INTEGRATED POWER FUNCTIONS 600V/8A low-loss CSTBT TM inverter bridge for three phase DC-to-AC power conversion INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS • • • • • For upper-leg IGBTS : Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection. For lower-leg IGBTS : Drive circuit, Control suppl.

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MITSUBISHI SEMICONDUCTOR PS21963-ET/-AET/-CET/-ETW TRANSFER-MOLD TYPE INSULATED TYPE PS21963-ET INTEGRATED POWER FUNCTIONS 600V/8A low-loss CSTBT TM inverter bridge for three phase DC-to-AC power conversion INTEGRATED DRIVE, PROTECTION AND SYSTEM CONTROL FUNCTIONS • • • • • For upper-leg IGBTS : Drive circuit, High voltage high-speed level shifting, Control supply under-voltage (UV) protection. For lower-leg IGBTS : Drive circuit, Control supply under-voltage protection (UV), Short circuit protection (SC), Over temperature protection (OT). Fault signaling : Corresponding to an SC fault (Lower-leg IGBT), a UV fault (Lower-side supply) or an OT fault (LVIC temperature). Input interface : 3V, 5V line (High Active). UL Approved : Yellow Card No. E80276 APPLICATION AC100V~200V three-phase inverter drive for small power motor control. Fig. 1 PACKAGE OUTLINES (PS21963-ET) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A www.DataSheet.net/ Dimensions in mm B TERMINAL CODE 3.5 0.28 1.778 ±0.2 16-0.5 1.5 ±0.05 17 1 2- 14.4 ±0.5 12 R1 .6 QR Code 3 MIN Type name Lot No. 0.8 HEAT SINK SIDE 18 0.28 2.54 ±0.2 14×2.54 (=35.56) 0.5 0.5 0.5 25 8-0.6 4-C1.2 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC (1) 14.4 ±0.5 0.4 29.2 ±0.5 24 ±0.5 (3.5) (3.3) 2.5 MIN 0.5 (2.656) (0~5°) 0.4 1.5 M IN 9.5±0.5 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) DETAIL B *) Two VNC terminals (9 & 16 pin) are connected inside DIPIPM, please connect either one to the 15V power supply GND outside and leave another one open. Mar. 2009 Datasheet pdf - http://www.DataSheet4U.co.kr/ MITSUBISHI SEMICONDUCTOR PS21963-ET/-AET/-CET/-ETW TRANSFER-MOLD TYPE INSULATED TYPE Fig. 2 LONG TERMINAL TYPE PACKAGE OUTLINES (PS21963-AET) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A B 3.5 16-0.5 1.5 ±0.05 Dimensions in mm TERMINAL CODE 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC 0.28 1.778 ±0.2 17 1 (1) 14.4 ±0.5 0.4 2- 14.4 ±0.5 12 R1 .6 QR Code 3 MIN Type name Lot No. 29.4 ±0.5 24 ±0.5 (3.5) 0.8 HEAT SINK SIDE 18 0.28 2.54 ±0.2 25 8-0.6 14×2.54 (=35.56) 0.5 0.5 0.5 (2.656) 0.5 2.5 MIN 4-C1.2 (3.3) (0~5°) 0.4 1.5 M IN 14±0.5 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) DETAIL B *) Two VNC terminals (9 & 16 pin) are connected inside DIPIPM, please connect either one to the 15V power supply GND outside and leave another one open. www.DataSheet.net/ Fig. 3 ZIGZAG TERMINAL TYPE PACKAGE OUTLINES (PS21963-CET) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A B 3.5 1.5 ±0.05 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. Dimensions in mm TERMINAL CODE NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC 17 1 (1) 18.9 ±0.5 14.4 ±0.5 33.7±0.5 2- 14.4 ±0.5 12 R1 .6 QR Code 3 MIN Type name Lot No. 29.2 ±0.5 24 ±0.5 (3.5) 0.8 HEAT SINK SIDE 0.4 0.4 0.28 1.778 ±0.2 16-0.5 18 0.28 2.54 ±0.2 14×2.54 (=35.56) 25 8-0.6 4-C1.2 0.5 0.5 0.5 (2.656) (0~5°) (0~5°) 0.4 1.5 M IN ±0.5 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) 9.5 DETAIL B *) Two VNC terminals (9 & 16 pin) are connected inside DIPIPM, please connect either one to the 15V power supply GND outside and leave another one open. Mar. 2009 2 Datasheet pdf - http://www.DataSheet4U.co.kr/ MITSUBISHI SEMICONDUCTOR PS21963-ET/-AET/-CET/-ETW TRANSFER-MOLD TYPE INSULATED TYPE Fig. 4 BOTH SIDES ZIGZAG TERMINAL TYPE PACKAGE OUTLINES (PS21963-ETW) 38 ±0.5 20×1.778(=35.56) 35 ±0.3 A B 3.5 1.5 ±0.05 0.4 Dimensions in mm TERMINAL CODE 1. 2. 3. 4. 5. 6. 7. 8. 9. 10. 11. 12. 13. 14. 15. 16. 17. 18. 19. 20. 21. 22. 23. 24. 25. NC VUFB VVFB VWFB UP VP WP VP1 VNC * UN VN WN VN1 FO CIN VNC * NC NC NC N W V U P NC 0.28 1.778 ±0.25 16-0.5 (1) 17 1 17.4 ±0.5 14.4 ±0.5 35.2 ±0.6 2- 17.4 ±0.5 14.4 ±0.5 12 R1 .6 QR Code 3 MIN Type name Lot No. 29.2 ±0.5 24 ±0.5 (3.5) 0.8 HEAT SINK SIDE 0.4 (1.8) 14×2.54(=35.56) 0.5 0.5 0.5 2.5 MIN (0~5°) 0.28 2.54 ±0.25 7-0.6 4-C1.2 0.4 (0~5°) 18 25 0.4 1.5 M (2.656) 11±0.5 IN 5.5±0.5 (1.2) (2.756) DETAIL A HEAT SINK SIDE (1.2) DETAIL B *) Two VNC terminals (9 & 16 pin) are connected inside DIPIPM, please connect either one to the 15V power supply GND outside and QR Code is registered trademark of DENSO WAVE INCORPORATED in Japan and other countries. leave another one open. Fig. 5 INTERNAL FUNCTIONS BLOCK DIAGRAM (TYPICAL APPLICATION EXAMPLE) www.DataSheet.net/ CBU– CBV– CBU+ CBW– CBV+ CBW+ C1 : Electrolytic type with good temperature and frequency characteristics (Note : The capacitance value depends .


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