SF2069A-1
• Low Insertion Loss • Hermetic 19 x 6.5 mm Surface-mount Case • Complies with Directive 2002/95/EC (RoHS) Absolute Maximum Ratings Rating
Maximum Incident Power in Passband Max. DC voltage between any 2 terminals Storage Temperature Range Suitable for lead-free soldering - Max. Soldering Profile
Pb
Value
+10 30 -40 to +150 260°C for 30 s
96.00 MHz SAW Filter
Units
dBm VDC °C
SMP-75 Electrical Characteristics Characteristic
Nominal Center Frequency ( @ 25°C ) Minimum Insertion Loss Attenuation Passband Amplitude Ripple (p-p) Group Delay Ripple Relative Attenuation (relative to αmin) αmin ≤ 1dB , B1dB ±2.40MHz ±2.40MHz 40 to 87 MHz 111 to 150 MHz Operating Temperature Impedance Matching to 50 Ω unbalanced Case Style Lid Symbolization (YY = year, WW = week) TA 1
Sym
fO
Notes
1
Min
95.9 4.3
Typ
96.00 14 5.0 0.8 80 48 55
Max
96.1 16 1.5 125
Units
MHz dB MHz dB ns dB dB °C
43 50 -40
+85 External L-C
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SMP-75 19 x 6.5 mm Nominal Footprint RFM SF2069A-1 YYWW
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes:
1. 2. 3. 4. 5. 6. 7. Unless noted otherwise, all specifications apply over the operating temperature range with filter soldered to the specified demonstration board with impedance matching to 50 W and measured with 50 Ω network analyzer. Unless noted otherwise, all frequency specifications are referenced to the nominal center frequency, fc. Rejection is measured as attenuation below the minimum IL point in the passband. Rejection in final user application is dependent on PCB layout and external impedance matching design. See Application Note No. 42 for details. "LRIP" or "L" after the part number indicates "low rate initial production" and "ENG" or "E" indicates "engineering prototypes." The design, manufacturing process, and specifications of this filter are subject to change. Either Port 1 or Port 2 may be used for either input or output in the design. However, impedances and impedance matching may vary between Port 1 and Port 2, so that the filter must always be installed in one direction per the circuit design. US and international patents may apply.
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Page 1 of 2 SF2069A-1 - 6/26/08
Datasheet pdf - http://www.DataSheet4U.co.kr/
SMP-75 Case
10-Terminal Ceramic Surface-Mount Case 19 x 6.5 mm Nominal Footprint
Case Dimensions
Dimension A B C D E H P Min 18.80 6.30 mm Nom 19.00 6.50 1.75 2.29 1.02 1.0 1.905 Max 19.30 6.80 2.00 Min 0.740 0.248 Inches Nom 0.748 0.256 0.069 0.090 0.040 0.039 0.075 Max 0.760 0.268 0.079
Electrical Connections
Connection Port 1 Port 2 Hot Ground Return Hot Ground Return Case Ground Single Ended Operation Differential Operation Terminals 10 1 5 6 All others Return is ground Return is hot
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Materials
Au plating 30 - 60 µinches (76.2-152 µm) over 80-200 µinches (203-508 µm) Ni. Fe-Ni-Co Alloy Electroless Nickel Plate (8-11% Phosphorus) 100-200 µinches Thick Al2O3 Cerami.