SF1186G
• • • • Designed for Front End GPS Applications Steep Rejection 2.5 x 2.0 x 1.0 mm Surface-Mount Case No Matching Circuit Required
1575.42 MHz SAW Filter
Value +10 +20 5 -40 to +85 Units dBm dBm VDC °C 265 °C for 10 s
Absolute Maximum Ratings
Rating Maximum Input Power, DC to 3 GHz Maximum Input Power, 0.8 to 1 GHz and 1.7 to 1.9 GHz Maximum DC Voltage On any Non-ground Terminal Storage Temperature Range in Tape and Reel Maximum Soldering Profile (5 cycles maximum)
SM2520-4 Electrical Characteristics
Characteristic Nominal Operating Frequency Passband Insertion Loss, fC ±1.0 MHz Amplitude Ripple, fC ±1.0 MHz Attenuation Referenced to 0 dB: DC to 1400 MHz 1400 to 1475 MHz 1475 to 1525 MHz 1625 to 1640 MHz 1640 to 2000 MHz 2000 to 3000 MHz S11 VSWR across fC ±1.0 MHz S22 VSWR across fC ±1.0 MHz Source impedance Load impedance Operating Temperature Sym fC IL Notes Min Typ 1575.42 1.5 0.1 37.0 34.0 37.0 45.0 34.0 28.0 1.2 1.2 50 50 Max 2.2 1.0 Units MHz dB dBP-P
35.0 30.0 25.0 30.0 32.0 20.0
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dB
2.0 2.0 Ω Ω °C
ZS ZL TA
-40
+85
Single-ended Input / Output Impedance Match Case Style Lid Symbolization (2A=SF1186G Y=year, W=week)
No matching network required for operation at 50 ohms SM2520-4 2A, YW
Electrical Connections
Connection Input Output Ground Terminals 1 3 All others
4 3 50 BOTTOM VIEW 50 1 2
RF IC
RF IC
CAUTION: Electrostatic Sensitive Device. Observe precautions for handling. Notes:
1. 2. US and international patents may apply. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc.
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[email protected] ©2009 by RF Monolithics, Inc.
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[email protected] ©2009 by RF Monolithics, Inc.
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[email protected] ©2009 by RF Monolithics, Inc.
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SM2520-4 Case
4-Terminal Ceramic Surface-Mount Case 2.5 X 2.0 mm Nominal Footprint
Case Dimensions Dimension Min
A B C D E F G 1.88 2.38 0.67 0.80 0.55 0.50
mm Nom
2.0 2.5 0.80 0.95 0.70 0.60
Max
2.12 2.62 1.00 0.83 1.10 0.85 0.70 Terminals 1 3 All others
Electrical Connections
Connection Port 1 Port 2 Single-ended Input Single-ended Output Ground Single-ended Operation Only
Materials
Solder Pad Plating
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0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel 2.0 to 3.0 µm Nickel Al2O3 Ceramic
Lid Plating Body Pb Free
TOP VIEW
BOTTOM VIEW
4
B
3
C
3
E
4 F
A
G
1
2
2
G
1
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PCB Foot Print
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Reel Dimension
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Tape Dimension
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.