SF2166E
• • SAW Filter for Digital Television
Complies with Directive 2002/95/EC (RoHS)
Pb
Characteristics: Balance-to-balanced operation Terminating source/load impedance : Maximum Rating Rating
Input Power Level DC Voltage on any Non-ground Terminal Operating Temperature Range Storage Temperature Range Maximum Soldering Profile, 5 cycles/ 10 seconds maximum
1280.18 MHz SAW Filter
Value
+10 3 -40 to +85 -50 to +95 265
ZS = 150 Ω Units
dBm V °C °C °C
SM3030-8
Electrical Characteristics Characteristic
Center Frequency Insertion Loss, 1260.18 to 1300.18 MHz Amplitude Ripple, 1260.18 to 1300.18 MHz Group Delay Ripple, 1260.18 to 1300.18 MHz Attenuation, 0 dB Reference: 100 to 1198.12 MHz 1362.24 to 2000 MHz 2000 to 6000 MHz Case Style Lid Symbolization (Y=year, WW=week, S=shift) dot=pin 1 indicator Standard Reel Quantity Reel Size 7 inch Reel Size 13 inch
www.DataSheet.net/
Sym
fC IL
Notes
Min
Typ
1280.18 3.2 1.0 20
Max
4.5 2.3 30
Units
MHz dB dB nsP-P
47 45 30
50 55 40 dB
SM3030-8 3.0 x 3.0 mm Nominal Footprint 858, YWWS 500 Pieces/Reel 3000 Pieces/Reel
Tuning Network, 150 ohm Balanced Source/Load
Notes: 1. US and international patents may apply. 2. RFM, stylized RFM logo, and RF Monolithics, Inc. are registered trademarks of RF Monolithics, Inc. 3. Electrostatic Sensitive Device. Observe precautions for handling.
www.RFM.com E-mail:
[email protected] © 2009-2011 by RF Monolithics, Inc.
Page 1 of 5 SF2166E - 4/28/11
Datasheet pdf - http://www.DataSheet4U.co.kr/
Filter S21, S11 and S22 Plots
Filter Shape Factor Plot
www.DataSheet.net/
www.RFM.com E-mail:
[email protected] © 2009-2011 by RF Monolithics, Inc.
Page 2 of 5 SF2166E - 4/28/11
Datasheet pdf - http://www.DataSheet4U.co.kr/
Filter Passband Plot
Filter Group Delay Plot
www.DataSheet.net/
www.RFM.com E-mail:
[email protected] © 2009-2011 by RF Monolithics, Inc.
Page 3 of 5 SF2166E - 4/28/11
Datasheet pdf - http://www.DataSheet4U.co.kr/
8-Terminal Ceramic Surface-Mount Case 3.0 X 3.0 mm Nominal Footprint
Case and PCB Footprint Dimensions
Dimension A B C D E F G H I J K L M N O Min 2.87 2.87 1.14 0.79 0.62 0.47 0.47 1.07 mm Nom 3.0 3.0 1.27 0.92 0.75 0.60 0.60 1.20 3.19 0.81 0.96 0.81 1.39 0.23 0.38 Max 3.13 3.13 1.40 1.05 0.88 0.73 0.73 1.33 Min 0.113 0.113 0.045 0.031 0.024 0.018 0.018 0.042 Inches Nom 0.118 0.118 0.050 0.036 0.029 0.024 0.024 0.047 0.126 0.032 0.038 0.032 0.055 0.009 0.015 Max 0.123 0.123 0.055 0.041 0.034 0.029 0.029 0.052 -
J K
J
I J
N L N
M
I
Case Materials
Materials
Solder Pad Plating
K O O
0.3 to 1.0 µm Gold over 1.27 to 8.89 µm Nickel 2.0 to 3.0 µm Nickel Al2O3 Ceramic Pb Free
www.DataSheet.net/
Lid Plating Body
PCB Footprint Top View
TOP VIEW
B 8 1 7 H 6 6 C 7 E
BOTTOM VIEW
8 1
858 YWWS
A
2
2 G
3 4
5
5 4 D F
3
www.RFM.com E-mail:
[email protected] © 2009-2011 by RF Monolithics, Inc.
Page 4 of 5 SF2166E - 4/28/11
Datasheet pdf - http://www.DataSheet4U.co.kr/
Tape and Reel Specifications
“B” Inches
7
100 REF. "B" REF.
Quantity Per Reel
178 330 500 3000
millimeters
13
See Detail "A" 12.0
13. 0
20 .2
www.DataSheet.net/
2.0
COMPONENT ORIENTATION and DIMENSIONS
Carrier Tape Dimensions Ao Bo Ko Pitch W
3.35 mm 3.35 mm 1.40 mm 8.0 mm 12.0 mm
0.3 ± 0.05
2.0
4.0 1.50
1.75 5.5
PIN #1
A
RO.3 (MAX.)
12.0
Bo
B Ao Ko
B Pitch A R0.5 (MAX.)
1.5 SECTION A-A SECTION B-B
USER DIRECTION OF FEED
www.RFM.com E-mail:
[email protected] © 2009-2011 by RF Monolithics, Inc.
Page 5 of 5 SF2166E - 4/28/11
Datasheet pdf - http://www.DataSheet4U.co.kr/
.