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WW .100Y.C M.TW WW .100Y.C M.TW WW 00Y.CO .TW WW 00Y.CO .TW W W W T .1 W.1 Y.COM W M. OM W O W C . W C W Y W .T W Y. W .100 M.T .100 OM W M.T .1 0 0 O W C . O W W C W Y W WW .100Y. .TW WW .100Y.C M.TW M.T .100 M O W O W C Walsin Technology Corporation . O W WW .100Y .TW WW .100Y.C M.TW WW .100Y.C M.TW M O W O W O W WW .100Y.C M.TW W Y.C WW .100Y.C M.TW 0 WW T . 0 FEATURE 1 OM WW 00Y.CO .TW W. WW 00Y.CO .TW C . W W W Y W W 1. Small M .1 .T weight 00size and light W.1 Y.COM W WW 00Y.CO .TW W.1 Y.COM W W W W W .T 00 W T M .1 00 2. High reliability and .stability W.1 Y.COM W WW 00Y.CO .TW W.1 Y.COM W W W W .T W 3. Reduced final equipment W .100 W.1 Y.COM W M.T .100size of OM W O W W C . W C W Y W .T W Y. costs W WW .100 4. Lower .assembly M.T .100 OM 100 W M.T O W C . O W W C W Y .C and .equipment W W WW .100Y. .TW TW M.T .100 5. W Higher component reliability 00Y M O 1 W M . O W C W .CO .TW WW .100Y. .TW WW .100Y.C M.TW WW free.1 6. Lead product M 00Y is available O W M O W O W WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW O WW 00Y.CO .TW W WW 00Y.CO .TW C . W W W Y W W M .1 .T 00 APPLICATION W.1 Y.COM W WW 00Y.CO .TW W.1 Y.COM W W W W W .T 00 W W.1 Y.COM W • Mobile phone M.T .100 W.1 Y.COM W O W W W C . W .T W .T WW .100Y .100 .TW 100 M . OM W M • PDA O W C . O W W C . Y W W W .TW W 00 0Y Y.C W .TW 1 0 0 W T M . . 1 0 M . O 1 W M . • Camcorders W O W O WW .100Y.C M.TW W W Y.C WW .100Y.C M.TW 0 W T . 0 O W • Pagers O W OM W.1 WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW O W O • Palmtop computers W O W WW .100Y.C M.TW WW .100Y.C M.TW WW .100Y.C M.TW O WW 00Y.CO .TW W WW 00Y.CO .TW C . W W W Y W W .T 100 W.1 Y.COM W.1 Y.COM W OM W DESCRIPTION WW. W C . W W .T W M.T .100 .TW 100 00Y M . O 1 W M . O W C . O W in a .C The resistors are constructed ceramic bodyW Internal metal electrodes C grade .high Yoxide). WW .1are . 00Y W (aluminum .TW of WW .TW paste that 100 00Yby a resistive M . OM 1 added at each end and connected is applied to the top surface the substrate. The W M . O W C . O W W C . Y W Y W W 00 Wresistance composition of the paste is adjusted to give the approximate and the value is trimmed to .TW 0Y.C WW .1 100required M .this OM W M.T by laser trimming .10 O W C . O W W nominated value within tolerance which controlled of resistive layer. C . Y W C W . 0 Y W W W WW .100Y .10 M.T .100 end O W M.T O W O The resistive layer is covered with a protective coat. Finally, the two external terminations are added. For W W C . W W .C 0Y.C Y W W W 0 0 Y W T . 1 0 0 W T . . 0 end terminations ease of soldering the outer layer of these is a Lead-tin or Tin (Lead free) M alloy. .1 O W O W OM W.1 WW .100Y.C WW .100Y.C M.TW WW .100Y.C M.TW W O W O W WW .100Y.C WW .100Y.C M.TW WW .100Y.C M.TW W O W O W WW .100Y WW .100Y.C M.TW WW .100Y.C M.TW W O W O W WW .100Y WW .100Y.C M.TW WW .100Y.C M.TW W O W O W WW .100 WW .100Y.C M.TW WW .100Y.C M.TW O WW W WW 00Y.CO .TW C . W W W Y W W .1 .T 00 W.1 Y.COM W WW W.1 Y.COM W W W W W .T 00 W . .T 00 W.1 Y.COM W WW W.