DatasheetsPDF.com

NT-UM01EBS-5572 Dataheets PDF



Part Number NT-UM01EBS-5572
Manufacturers HK NATER TECH
Logo HK NATER TECH
Description WIFI Module
Datasheet NT-UM01EBS-5572 DatasheetNT-UM01EBS-5572 Datasheet (PDF)

HK NATER TECH LIMITED NT-UM01EBS-5572 Customer: Description: Customer P/N:_______________________________________ Date:_______________________________________________ Customer Approve Auditing Admit NT -UM01EBS-5572 V1.0 Provider Approve Auditing Admit : : : : : E-mail: :HK NATER TECH LIMITED :2 :0755-61522172/13510620050 :0755-61522171 : E-mail:[email protected] :,! Free Datasheet http://www.datasheet4u.com/ SPECIFICATIONS IEEE 802.11 a/b/g/n 2.4 to 5.8 GHz 2T2R WIFI Mo.

  NT-UM01EBS-5572   NT-UM01EBS-5572



Document
HK NATER TECH LIMITED NT-UM01EBS-5572 Customer: Description: Customer P/N:_______________________________________ Date:_______________________________________________ Customer Approve Auditing Admit NT -UM01EBS-5572 V1.0 Provider Approve Auditing Admit : : : : : E-mail: :HK NATER TECH LIMITED :2 :0755-61522172/13510620050 :0755-61522171 : E-mail:[email protected] :,! Free Datasheet http://www.datasheet4u.com/ SPECIFICATIONS IEEE 802.11 a/b/g/n 2.4 to 5.8 GHz 2T2R WIFI Module NT-UM01EBS-5572-V1.0 Combo Module Free Datasheet http://www.datasheet4u.com/ Overview NT-UM01EBS-5572-V1.0 is a integrated MAC/BBP and 2.4/5 GHz RF/PA/LNA single module which supports a 300 Mbps PHY rate. It fully complies with IEEE 802.11n and IEEE 802.11 b/g standards, offering feature-rich wireless connectivity at a high standard, and delivering reliable,cost-effective throughput from an extended distance. Optimized performance RF architecture and baseband algorithms provide superb and low power consumption. Intelligent MAC design deploys a highly efficient DMA engine and hardware data processing accelerators without overloading the host processor. The NT-UM01EBS-5572-V1.0 is desi gned features in the areas of security, quality of regulations, giving end users the greatest any circumstance. to support standard-based service, and international performance anytime and in Free Datasheet http://www.datasheet4u.com/ Features z CMOS Technology with an integrated PA, LNA, RF, Baseband, and MAC z 2T2R Mode with support for a 300 Mbps Tx/Rx PHY Rate z Legacy and High Throughput Modes z 20 MHz/40 MHz Bandwidth z Reverse Direction Grant Data Flow and Frame Aggregation z Multiple BSSID Support z Bluetooth Co-existence z Security: WEP 64/128, WPA, WPA2, TKIP, AES, WAPI z QoS-WMM, WMM-PS z WPS/ WPS2.0: PIN, PBC z Cisco CCX Support z USB 2.0 z Low Power with Advanced Power Management z Support for Windows XP 32/64, 2000, Vista 32/64, Windows 7 32/64, Linux, Macintosh Free Datasheet http://www.datasheet4u.com/ General Specification Model Product Name MajorChipset Standard Data Transfer Rate Modulation Method Frequency Band NT-UM01EBS-5572-V1.0 WLAN 11n USB module MT5572 (MTK/Ralink) 802.11a/b/g/n 1,2,5.5,6,11,12,18,22,24,30,36,48,54,60,90,120 and maximum of 300Mbps QoS-WMM, WMM-PS;WPS/ WPS2.0: PIN, PBC 2.4~5.8 GHz ISM Band IEEE 802.11a: ISM(Industrial Scientific Medical) IEEE 802.11b: DSSS (Direct Sequence Spread Spectrum) Spread Spectrum IEEE 802.11g/n:OFDM (Orthogonal Frequency Division Multiplexing) < 18dBm@11b,< 14dBm@11g ,< 13dBm@11n, RF Output Power <12dBm@11a Operation Mode Ad hoc, Infrastructure Receiver 11Mbps -86dBm@8%,135Mbps -73dBm@10%,300Mbps Sensitivity -66dBm@10% OS Support Security Interface Power Consumption Operating Channel Operating Temperature Storage Temperature Humidity Dimension Windows XP 32/64, 2000, Vista 32/64, Windows 7 32/64, Linux, Macintosh WEP 64/128, WPA, WPA2, TKIP, AES, WAPI USB 2.0 DC3.3V 11: (Ch. 1-11) – United States 13: (Ch. 1-13) – Europe 14: (Ch. 1-14) – Japan -20 ~ +60° C ambient temperature -10 ~ 70°C ambient temperature 5 to 90 % maximum (non-condensing) 27.0 x 17.8537 x 1.9mm (LxWxH) +-0.2MM Free Datasheet http://www.datasheet4u.com/ Diagram Dimensions: Mechanical Dimensions (mm) Length 27.000 (Tolerance:±0.2mm) Width 17.8537 (Tolerance:±0.2mm) Height 1.9 (Tolerance:±0.2mm) Free Datasheet http://www.datasheet4u.com/ MODULE PIN ASSIGNMENT Pin H1 H2 H3 H4 H5 H6 Function NC GND D+ DVDD33 NC Pin H7 H8 H9 H10 H11 H12 Function GND RF GND GND RF GND Packaging Appearance Figure Free Datasheet http://www.datasheet4u.com/ Physical map External antenna reference design DC Characteristics Symbol VD33A, VD33D VD15A, VD15D IDD33 Parameter 3.3V I/O Supply Voltage 1.5V Supply Voltage 3.3V Rating Current Minimum 3.1 1.4 Typical 3.3 1.5 Maximum 3.5 1.6 400 Units V V mA Free Datasheet http://www.datasheet4u.com/ Power Consumption Parameters 3.3V Supply Voltage 1.5V Supply Voltage Receiving Tests the biggest receive 3.3V Current Consumption 3.3V Current Consumption Transmission Biggest transmission test 3.3V Current Consumption Icc33tx Icc33tx Icc33tx/rx Ic33tx/rx H40 MCS7 OFDM 54M 80 85 2 2 mA mA mA mA Icc33rx Icc33rx H40MCS7 OFDM 54M 65 70 mA mA Sym Vc33 Vc15 Conditions Min 3.1 1.4 Typ 3.3 1.5 Max 3.5 1.6 Unit V V 3.3V Current Consumption The depth waits for an opportunity Deep sleep USB interface electrical characteristics :1.USB 90Ohm 。 2., wifi , wifi 。 Note:1.Two root go line do difference , but also required to make 90Ohm the impedance test.e get lock can do 2.Suggested that leave a power switch power supply input terminal ,every tim a electric power is on Free Datasheet http://www.datasheet4u.com/ Patch WIFI module installed before the Note: 1. customers must open stencil WIFI module pad holes open, press 1 to 1 0.7mm proportion to open outward expansion, thickness 0.12MM. 2. there is need to take a WIFI mode must not bare hands to pick up the WIFI modul.


MW74HC245 NT-UM01EBS-5572 MT6628


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)