NUP2114UCMR6 Datasheet PDF


Part Number

NUP2114UCMR6

Description

Transient Voltage Suppressors

Manufacture

ON Semiconductor

Total Page 5 Pages
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Download NUP2114UCMR6 Datasheet PDF


Features Datasheet pdf NUP2114UCMR6 Transient Voltage Suppresso rs Low Capacitance ESD Protection for H igh Speed Data The NUP2114UCMR6 transie nt voltage suppressor is designed to pr otect high speed data lines from ESD. U ltra−low capacitance and high level o f ESD protection makes this device well suited for use in USB 2.0 high speed a pplications. Features http://onsemi.com I/O VP • • • • • • • • • • • Low Capacitance 0.8 pF Low Clamping Voltage Stand Off Volta ge: 5 V Low Leakage ESD Rating of Class 3B (Exceeding 8 kV) per Human Body mod el and Class C (Exceeding 400 V) per Ma chine Model IEC61000−4−2 Level 4 UL Flammability Rating of 94 V−0 This i s a Pb−Free Device High Speed Communication Line Protection USB 2.0 .
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NUP2114UCMR6 Datasheet
NUP2114UCMR6
Transient Voltage
Suppressors
Low Capacitance ESD Protection for
High Speed Data
The NUP2114UCMR6 transient voltage suppressor is designed to
protect high speed data lines from ESD. Ultralow capacitance and
high level of ESD protection makes this device well suited for use in
USB 2.0 high speed applications.
Features
Low Capacitance 0.8 pF
Low Clamping Voltage
Stand Off Voltage: 5 V
Low Leakage
ESD Rating of Class 3B (Exceeding 8 kV) per Human Body model
and Class C (Exceeding 400 V) per Machine Model
IEC6100042 Level 4
UL Flammability Rating of 94 V0
This is a PbFree Device
Typical Applications
High Speed Communication Line Protection
USB 2.0 High Speed Data Line and Power Line Protection
Gigabit Ethernet
Notebook Computers
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Rating
Symbol
Value
Unit
Operating Junction Temperature Range TJ 40 to +125 °C
Storage Temperature Range
Tstg 55 to +150 °C
Lead Solder Temperature
Maximum (10 Seconds)
TL 260 °C
Human Body Model (HBM)
Machine Model (MM)
IEC6100042 Contact
IEC6100042 Air
ESD
16000
400
13000
15000
V
Stresses exceeding Maximum Ratings may damage the device. Maximum
Ratings are stress ratings only. Functional operation above the Recommended
Operating Conditions is not implied. Extended exposure to stresses above the
Recommended Operating Conditions may affect device reliability.
See Application Note AND8308/D for further description of
survivability specs.
http://onsemi.com
I/O VP
I/O
MARKING
DIAGRAM
1
TSOP6
CASE 318G
P2M MG
G
1
P2M = Specific Device Code
M = Date Code
G = PbFree Package
(Note: Microdot may be in either location)
PIN CONNECTIONS
I/O 1
6 I/O
VN 2
NC 3
5 VP
4 NC
ORDERING INFORMATION
Device
Package
Shipping
NUP2114UCMR6T1G TSOP6 3000 / Tape &
(PbFree)
Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
Brochure, BRD8011/D.
© Semiconductor Components Industries, LLC, 2010
January, 2010 Rev. 4
1
Publication Order Number:
NUP2114UCMR6/D
Free Datasheet http://www.datasheet4u.com/




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