Power MOSFET
NVMFD5853NL
Power MOSFET
40 V, 10 mW, 34 A, Dual N−Channel Logic Level, Dual SO−8FL
Features
• Small Footprint (5x6 mm...
Description
NVMFD5853NL
Power MOSFET
40 V, 10 mW, 34 A, Dual N−Channel Logic Level, Dual SO−8FL
Features
Small Footprint (5x6 mm) for Compact Designs Low RDS(on) to Minimize Conduction Losses Low Capacitance to Minimize Driver Losses NVMFD5853NLWF − Wettable Flanks Option for Enhanced Optical
Inspection
AEC−Q101 Qualified and PPAP Capable This is a Pb−Free Device
MAXIMUM RATINGS (TJ = 25°C unless otherwise noted)
Parameter
Symbol Value Unit
Drain−to−Source Voltage
VDSS
40
V
Gate−to−Source Voltage
VGS
"20 V
Continuous Drain Cur-
Tmb = 25°C
ID
rent RYJ−mb (Notes 1, 2, 3, 4)
Steady Tmb = 100°C
Power Dissipation
State
Tmb = 25°C
PD
RYJ−mb (Notes 1, 2, 3)
Tmb = 100°C
34
A
24
24
W
12
Continuous Drain Cur-
TA = 25°C
ID
rent RqJA (Notes 1, 3 & 4)
Steady TA = 100°C
Power Dissipation RqJA (Notes 1 & 3)
State
TA = 25°C
PD
TA = 100°C
12
A
8.5
3.0
W
1.5
Pulsed Drain Current TA = 25°C, tp = 10 ms
IDM
165
A
Operating Junction and Storage Temperature
TJ, Tstg − 55 to °C 175
Source Current (Body Diode)
IS
Single Pulse Drain−to−Source Avalanche
EAS
Energy (TJ = 25°C, VGS = 10 V, IL(pk) = 28.3 A,
L = 0.1 mH, RG = 25 W)
Lead Temperature for Soldering Purposes
TL
(1/8″ from case for 10 s)
34
A
40
mJ
260 °C
Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected.
THERMAL RESIS...
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