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MLG0603Q3N1 Dataheets PDF



Part Number MLG0603Q3N1
Manufacturers TDK
Logo TDK
Description SMD Inductors
Datasheet MLG0603Q3N1 DatasheetMLG0603Q3N1 Datasheet (PDF)

(1/6) SMD Inductors(Coils) For High Frequency(Multilayer) MLG Series MLG0603Q Type FEATURES • It serializes a product of acquisition inductance 0.3 to15nH. In a product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe. • By the most suitable design, Q is higher than competing in a conventional product MLG0603S type. In particular, Q in more than 800MHz largely improved. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materi.

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(1/6) SMD Inductors(Coils) For High Frequency(Multilayer) MLG Series MLG0603Q Type FEATURES • It serializes a product of acquisition inductance 0.3 to15nH. In a product of 0.3 to 1.0nH, it realizes line up in a 0.1nH steppe. • By the most suitable design, Q is higher than competing in a conventional product MLG0603S type. In particular, Q in more than 800MHz largely improved. • Advanced monolithic structure is formed using a multilayering and sintering process with ceramic and conductive materials for high-frequency. • The products contain no lead and also support lead-free soldering. APPLICATIONS For high-frequency applications including mobile phones, high frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB and tuners. SHAPES AND DIMENSIONS 0.6±0.03 Conformity to RoHS Directive PRODUCT IDENTIFICATION MLG 0603 Q 2N2 S T (1) (2) (3) (4) (5) (6) (1) Multilayer ceramic chip coil (2) Dimensions 0603 0.6× 0.3mm (L× W) (3) Series name (4) Inductance value 2N2 12N 2.2nH 12nH (5) Inductance tolerance B C S H J ±0.1nH ±0.2nH ±0.3nH ±3% ±5% 0.3±0.03 (6) Packaging style T 0.06±0.04 Taping (reel) SPECIFICATIONS 0.3±0.03 Operating temperature range Storage temperature range Weight: 0.2mg –55 to +125°C –55 to +125°C [Unit of products] PACKAGING STYLE AND QUANTITIES Packaging style Taping Quantity 15000 pieces/reel 0.15±0.05 Dimensions in mm RECOMMENDED PC BOARD PATTERN 0.25 to 0.35 0.2 to 0.3 0.25 to 0.35 0.2 to 0.3 Dimensions in mm RECOMMENDED SOLDERING CONDITION REFLOW SOLDERING 10s max. 250 to 260˚C 230˚C Natural cooling HANDLING AND PRECAUTIONS • Before soldering, be sure to preheat components. The preheating temperature should be set so that the temperature difference between the solder temperature and product temperature does not exceed 150°C. • After mounting components onto the printed circuit board, do not apply stress through board bending or mishandling. • When hand soldering, apply the soldering iron to the printed circuit board only. Temperature of the iron tip should not exceed 350°C. Soldering time should not exceed 3 seconds. 180˚C 150˚C Preheating 60 to 120s Time(s) Soldering 30 to 60s • Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications. • Please contact our Sales office when your application are considered the following: The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.) • All specifications are subject to change without notice. 003-01 / 20070703 / e521_mlg0603q.fm Free Datasheet http://www.datasheet4u.com/ (2/6) ELECTRICAL CHARACTERISTICS Inductance (nH) 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 1.5 1.6 1.7 1.8 1.9 2.0 2.1 2.2 2.3 2.4 2.5 2.6 2.7 2.8 2.9 3.0 3.1 3.2 3.3 3.4 3.5 3.6 3.7 3.8 3.9 4.0 4.3 4.7 5.1 5.6 6.2 6.8 7.5 8.2 9.1 10 12 15 ∗ Inductance tolerance ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±0.1, ±0.2, 0.3nH ±3%, ±0.3nH ±3%, ±0.3nH ±3%, ±0.3nH ±3%, ±0.3nH ±3%, ±0.3nH ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% ±3, ±5% Q min. — — — — — — — 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 5 6 6 Test frequency L, Q (MHz) 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 100 Self-resonant frequency (GHz) min. typ. 10.0 20up 10.0 20up 10.0 20up 10.0 20up 10.0 20up 10.0 17.5 10.0 16.3 10.0 14.2 10.0 14.9 10.0 14.7 10.0 13.6 9.0 12.0 9.0 10.7 9.0 11.3 8.5 10.0 8.5 10.3 7.5 8.9 7.5 9.4 7.5 8.8 7.5 9.3 7.5 10.0 7.5 9.3 7.0 9.1 6.5 8.0 6.5 7.7 6.2 7.9 6.2 7.6 6.0 7.4 6.0 7.2 6.0 7.1 5.8 7.1 5.8 7.1 5.8 6.8 5.8 7.4 5.8 7.4 5.8 7.3 5.8 7.3 5.8 7.1 5.2 6.4 5.2 6.9 5.0 6.0 4.2 5.5 4.2 5.3 4.2 5.5 3.8 4.8 3.8 4.9 3.6 4.4 3.6 4.7 3.0 3.8 3.0 3.8 DC resistance (Ω) max. 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.10 0.15 0.15 0.15 0.15 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.20 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.30 0.35 0.35 0.40 0.40 0.40 0.40 0.40 0.45 0.50 0.50 0.55 0.60 0.70 0.70 0.80 0.80 1.00 1.10 typ. 0.02 0.02 0.02 0.03 0.04 0.03 0.04 0.06 0.06 0.05 0.05 0.06 0.08 0.08 0.08 0.09 0.08 0.09 0.09 0.


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