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MMSZ13T1G Dataheets PDF



Part Number MMSZ13T1G
Manufacturers ON Semiconductor
Logo ON Semiconductor
Description Zener Voltage Regulator
Datasheet MMSZ13T1G DatasheetMMSZ13T1G Datasheet (PDF)

MMSZxxxT1G Series, SZMMSZxxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Features • 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 56 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • ESD Rating.

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MMSZxxxT1G Series, SZMMSZxxxT1G Series Zener Voltage Regulators 500 mW SOD−123 Surface Mount Three complete series of Zener diodes are offered in the convenient, surface mount plastic SOD−123 package. These devices provide a convenient alternative to the leadless 34−package style. Features • 500 mW Rating on FR−4 or FR−5 Board • Wide Zener Reverse Voltage Range − 2.4 V to 56 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • ESD Rating of Class 3 (> 16 kV) per Human Body Model • AEC−Q101 Qualified and PPAP Capable • SZ Prefix for Automotive and Other Applications Requiring Unique Site and Control Change Requirements • Pb−Free Packages are Available* Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily Solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES: 260°C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0 MAXIMUM RATINGS Rating Symbol Max Unit Total Power Dissipation on FR−5 Board, PD (Note 1) @ TL = 75°C Derated above 75°C 500 mW 6.7 mW/°C Thermal Resistance, Junction−to−Ambient RqJA (Note 2) 340 °C/W Thermal Resistance, Junction−to−Lead (Note 2) RqJL 150 °C/W Junction and Storage Temperature Range TJ, Tstg −55 to +150 °C Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. 1. FR−5 = 3.5 X 1.5 inches. 2. Thermal Resistance measurement obtained via infrared Scan Method. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. www.onsemi.com SOD−123 CASE 425 STYLE 1 1 Cathode 2 Anode MARKING DIAGRAM 1 xx M G G xx = Device Code M = Date Code G = Pb−Free Package (Note: Microdot may be in either location) ORDERING INFORMATION Device Package Shipping† MMSZxxxT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel SZMMSZxxxT1G SOD−123 (Pb−Free) 3,000 / Tape & Reel MMSZxxxT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel SZMMSZxxxT3G SOD−123 (Pb−Free) 10,000 / Tape & Reel †For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. DEVICE MARKING INFORMATION See specific marking information in the device marking column of the Electrical Characteristics table on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2012 1 August, 2019 − Rev. 12 Publication Order Number: MMSZ2V4T1/D MMSZxxxT1G Series, SZMMSZxxxT1G Series ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted, VF = 0.95 V Max. @ IF = 10 mA) Symbol Parameter VZ Reverse Zener Voltage @ IZT IZT Reverse Current ZZT Maximum Zener Impedance @ IZT IR Reverse Le.


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