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MCFT06

multicomp

(MCFT02 - MCFT06) Wire Wound Chip Inductor

Wire Wound Chip Inductor Features •  •  •  •  •  Ceramic base provide high SRF Ultra-compact inductors provide high Q fa...


multicomp

MCFT06

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Description
Wire Wound Chip Inductor Features           Ceramic base provide high SRF Ultra-compact inductors provide high Q factors Low profile, high current options Miniature SMD chip inductor for fully automated assembly Outstanding endurance from Pull-up force, mechanical  shock and pressure   Tighter tolerance down to ±2%   Smaller size of 0402 (1005) Construction Applications RF Products:                   Cellular Phone (CDMA/GSM/PHS) Cordless Phone (DECT/CT1CT2) Remote Control, Security System Wireless PDA Smart Phone WLL, Wireless LAN / Mouse / Keyboard / Earphone VCO, RF Module & Other Wireless Products Base Station, Repeater GPS Receiver 1 2 Ceramic Core Magnet Wire 3 Electrode (Ag/Pd+Ni+Sn) 4 UV Glue Broad Band Applications:   CATV Filter, Tuner   Cable Modem/ XDSL Tuner   Set Top Box IT Applications:   USB 2.0   IEEE 1394 Dimensions Standard Type MCFT02 MCFT03 MCFT05 MCFT06 Size (Inch) 0402 0603 0805 1206 A max. 1.27 1.8 2.29 3.45 B max. 0.76 1.12 1.73 1.9 C max. 0.61 1.02 1.52 1.4 D Ref. 0.15 0.38 0.51 0.5 E 0.51 0.76 1.27 1.6 F 0.23 0.33 0.44 0.5 G 0.56 0.86 1.02 2.2 H 0.66 1.02 1.78 1.93 I 0.5 0.64 1.02 1.02 J 0.46 0.64 0.76 1.78 Unit: mm Weight (g) (1,000pcs) 0.8 3.46 12.13 40 www.element14.com www.farnell.com www.newark.com Page <1> 18/07/12 V1.0 Free Datasheet http://www.datasheet4u.com/ Wire Wound Chip Inductor Low Profile Type MCFT05 Size (Inch) 0805 A max. 2.29 B max. 1.73 C max. 1.03 D Ref. 0.51 E 1.27 F 0.44 G 1.02 H 1.78 I 1.02 U...




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