Charger Protector. APL3225 Datasheet

APL3225 Protector. Datasheet pdf. Equivalent

Part APL3225
Description Li+ Charger Protector
Feature APL3225 Li+ Charger Protection IC Features • • • • • • • • • • Provide OUT Pin 5V Voltage Clamping .
Manufacture ANPEC
Datasheet
Download APL3225 Datasheet

APL3225 Li+ Charger Protection IC Features • • • • • • • • APL3225 Datasheet
Recommendation Recommendation Datasheet APL3225 Datasheet





APL3225
APL3225
Li+ Charger Protection IC
Features
General Description
Provide OUT Pin 5V Voltage Clamping Protection
Thermal Charging Regulation Protection
Provide Input Over-voltage Protection
Provide Input Over-current Protection
Provide Over Temperature Protection
Provide Reverse Current Blocking
High Immunity of False Triggering
High Accuracy Protection Threshold
Low On Resistance 0.3Typ.
Compact TDFN2x2-8 and DFN3x3-8 Packages
Lead Free and Green Devices Available
(RoHS Compliant)
Applications
Cell Phones
Pin Configuration
The APL3225 provides complete Li+ charger protection
against input over-voltage, input over-current and over-
temperature. When any of the monitored parameters is
over the threshold, the IC turns off the charging current.
All protections also have deglitch time against false trig-
gering due to voltage spikes or current transients.
The APL3225 integrates a 5.5V LDO to prevent ACIN over-
shoot reaching CHR_LDO and OUT. When any transient
peak voltage above 5.5V presenting in ACIN pin, but be-
low OVP threshold, the internal LDO will clamp its output
at 5.5V. When ACIN voltage exceeds OVP threshold, the
device will turn off charging current. The charging current
is controlled by the GATDRV pin. When sourcing a cur-
rent from the GATDRV pin, the OUT pin delivers the charg-
ing current which is 200-fold magnified in amplitude
based on GATDRV’s current.
Other features include accurate VVCDT/VACIN voltage divider,
reverse current blocking from OUT to ACIN and OTP
protection. The APL3225 provides complete Li+ charger
protections, and saves the external MOSFET and Schottky
diode for the charger of cell phone’s PMIC. The above
features and small package make the APL3225 an ideal
part for cell phones applications.
ACIN 1
ACIN 2
GND 3
VCDT 4
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
DFN3x3-8
(Top View)
ACIN 1
ACIN 2
GND 3
VCDT 4
8 OUT
7 OUT
6 CHR_LDO
5 GATDRV
TDFN2x2-8
(Top View)
= Exposed Pad (connected to ground
plane for better heat dissipation)
Simplified Application Circuit
5V
Adapter
ACIN CHR_LDO
APL3225
GATDRV
VCDT
OUT
GND
Li+
Battery
CHR_LDO
PMIC
GATDRV
VCDT
ISENS
VBAT
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
1
www.anpec.com.tw
Free Datasheet http://www.datasheet4u.com/



APL3225
APL3225
Ordering and Marking Information
APL3225
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
QB : TDFN2x2-8 QA : DFN3x3-8
Operating Ambient Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
APL3225 QB:
L25
X
X - Date Code
APL3225 QA:
APL
3225
XXXXX
X - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note1)
Symbol
Parameter
Rating
Unit
VACIN
VCHR_LDO
VGATDRV
VCDT
VOUT
IOUT
TJ
TSTG
TSDR
ACIN Input Voltage (ACIN to GND)
CHR_LDO to GND Voltage
GATDRV to GND Voltage
VCDT to GND Voltage
OUT to GND Voltage
Output Current (OUT to GND)
Maximum Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature (10 Seconds)
-0.3 ~ 28
-0.3 ~ 7
-0.3 ~ VCHR_LDO
-0.3 ~ 7
-0.3 ~ 7
2
150
-65 ~ 150
260
V
V
V
V
V
A
oC
oC
oC
Note 1:Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under ”recom-
mended operating conditions”is not implied. Exposure to absolute maximum rating conditions for extended periods may affect vice
reliability.
Thermal Characteristic
Symbol
Parameter
Typical Value
Unit
θJA TDFN2x2-8 Junction-to-Ambient Resistance in free air (Note 2)
θJA DFN3x3-8 Junction-to-Ambient Resistance in free air (Note 2)
75 oC/W
65 oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed
pad of TDFN2x2-8 is soldered directly on the PCB.
Copyright © ANPEC Electronics Corp.
Rev. A.1 - Nov., 2012
2
www.anpec.com.tw
Free Datasheet http://www.datasheet4u.com/





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