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HFBR-5301 Dataheets PDF



Part Number HFBR-5301
Manufacturers Agilent(Hewlett-Packard)
Logo Agilent(Hewlett-Packard)
Description Fibre Channel 133 MBd and Fibre Channel 133 MBd and Cost 1x9 Package Style
Datasheet HFBR-5301 DatasheetHFBR-5301 Datasheet (PDF)

Fibre Channel 133 MBd and 266 MBd Transceivers in Low Cost 1x9 Package Style Technical Data HFBR-5301 133 MBd HFBR-5302 266 MBd Features • Full Compliance with ANSI X3T11 Fibre Channel Physical and Signaling Interface • Multisourced 1x9 Package Style with Duplex SC Connector • Wave Solder and Aqueous Wash Process Compatibility • Compatible with Various Manufacturers FC-0 and FC-1 Circuits The products are produced in the new industry standard 1x9 SIP package style with a duplex SC connector in.

  HFBR-5301   HFBR-5301


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Fibre Channel 133 MBd and 266 MBd Transceivers in Low Cost 1x9 Package Style Technical Data HFBR-5301 133 MBd HFBR-5302 266 MBd Features • Full Compliance with ANSI X3T11 Fibre Channel Physical and Signaling Interface • Multisourced 1x9 Package Style with Duplex SC Connector • Wave Solder and Aqueous Wash Process Compatibility • Compatible with Various Manufacturers FC-0 and FC-1 Circuits The products are produced in the new industry standard 1x9 SIP package style with a duplex SC connector interface as defined in the Fiber Channel ANSI FC-PH standard document. The HFBR-5301 is a 1300 nm transceiver specified for use in 133 MBd, 12.5 MB/s, 12-M6-LE-I Fibre Channel interfaces to either 62.5/125 µm or 50/125 µm multimode fiber-optic cables. The HFBR-5302 is a 1300 nm transceiver specified for use in 266 MBd, 25 MB/s, 25-M6-LE-I Fibre Channel interfaces to either 62.5/125 µm or 50/125 µm multimode fiber-optic cables. Applications • Fibre Channel 12.5 MB/s 12-M6-LE-I Interfaces for 1300 nm LED Links to 1500 m • Fibre Channel 25 MB/s 25-M6-LE-I Interfaces for 1300 nm LED Links to 1500 m These are packaged in the optical subassembly portion of the receiver. These PIN/preamplifier combinations are coupled to a custom quantizer IC which provides the final pulse shaping for the logic output and the Signal Detect function. The Data output is differential. The Signal Detect output is single-ended. Both data and signal detect outputs are PECL compatible, ECL referenced (shifted) to a +5 volt power supply. Transmitter Sections The transmitter sections of the HFBR-5301 and HFBR-5302 utilize 1300 nm InGaAsP LEDs. These LEDs are packaged in the optical subassembly portion of the transmitter section. They are driven by a custom silicon IC which converts PECL logic signals, into an analog LED drive current. Description The HFBR-5301 and HFBR-5302 Fibre Channel Transceivers from Hewlett-Packard provide the system designer with products to implement Fibre Channel designs for use in multimode fiber (MMF) applications. These include the 12.5 MB/sec 12-M6-LE-I interface and the 25 MB/sec 25-M6-LE-I interface for 1300 nm LED links. Package The overall package concept for the HP Fibre Channel transceivers consists of three basic elements; the two optical subassemblies, an electrical subassembly and the housing with integral duplex SC connector interface. This is illustrated in the block diagram in Figure 1. 215 Receiver Sections The receiver sections of the HFBR-5301 and HFBR-5302 utilize InGaAs PIN photo diodes coupled to a custom silicon transimpedance preamplifier IC. 5963-5608E (3/95) ELECTRICAL SUBASSEMBLY DATA OUT SIGNAL DETECT OUT DUPLEX SC RECEPTACLE PIN QUANTIZER IC PREAMP IC OPTICAL SUBASSEMBLIES The electrical subassembly consists of a high volume multilayer printed circuit board to which the IC chips and various surfacemount passive circuit elements are attached. The package includes internal shields for the electrical and optical subassemblies to insure high immunity to external EMI fields and low EMI emissions. The outer housing, including the duplex SC connector, is molded of filled non-conductive plastic to provide mechanical strength and electrical isolation. The solder posts are isolated from the circuit design of the transceiver, while they can be connected to a ground plane on the circuit board, doing so will have no impact on circuit performance. The transceiver is attached to a printed circuit board with the nine signal pins and the two solder posts which exit the bottom of the housing. The two solder posts provide the primary mechanical strength to withstand the loads imposed on the transceiver by mating with the duplex SC connectored fiber cables. LED DATA IN DRIVER IC TOP VIEW Figure 1. Block Diagram. The package outline drawing and pin out are shown in Figures 2 and 3. The details of this package outline and pin out are compliant with the multisource definition of the 1x9 single in-line package (SIP). The low profile of the Hewlett-Packard transceiver design complies with the 39.12 MAX. (1.540) maximum height allowed for the duplex SC connector over the entire length of the package. The optical subassemblies utilize a high volume assembly process together with low cost lens elements which result in a cost effective building block. 12.70 (0.500) 25.40 MAX. (1.000) AREA RESERVED FOR PROCESS PLUG 12.70 (0.500) DATE CODE (YYWW) H SINGAPORE HFBR-5XXX 3.30 ± 0.38 (0.130 ± 0.015) + 0.08 - 0.05 + 0.003 ) (0.030 - 0.002 0.75 10.35 MAX. (0.407) Application Information 2.92 (0.115) ø 0.46 (9x) (0.018) NOTE 1 18.52 (0.729) 4.14 (0.163) + 0.25 - 0.05 + 0.010 ) (0.050 - 0.002 NOTE 1 1.27 23.55 (0.927) 20.32 [8x(2.54/.100)] (0.800) 16.70 (0.657) 17.32 20.32 23.32 (0.682) (0.800) (0.918) 0.87 (0.034) 23.24 (0.915) 15.88 (0.625) The Applications Engineering group in the Hewlett-Packard Optical Communication Division is available to assist with the technical understanding and design trade-.


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