DatasheetsPDF.com

Single-Chip Microcomputer. H8S2673 Datasheet

DatasheetsPDF.com

Single-Chip Microcomputer. H8S2673 Datasheet






H8S2673 Microcomputer. Datasheet pdf. Equivalent




H8S2673 Microcomputer. Datasheet pdf. Equivalent





Part

H8S2673

Description

16-Bit Single-Chip Microcomputer



Feature


REJ09B0283-0300 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. D etails should always be checked by refe rring to the relevant text. 16 H8S/26 78 Group, H8S/2678R Group, H8S/2676 F-Z TAT Hardware Manual Renesas 16-Bit S ingle-Chip Microcomputer H8S Family/H8S /2600 Series H8S/267.
Manufacture

Renesas

Datasheet
Download H8S2673 Datasheet


Renesas H8S2673

H8S2673; 6 H8S/2675 H8S/2674R H8S/2673 H8S/2670 H D64F2676 HD6432676 HD6432675 HD6412674R HD6432673 HD6412670 Rev. 3.00 Revisio n Date: Mar 17, 2006 Free Datasheet ht tp://www.datasheet4u.com/ Keep safety first in your circuit designs! 1. Renes as Technology Corp. puts the maximum ef fort into making semiconductor products better and more reliable, but there is always the possib.


Renesas H8S2673

ility that trouble may occur with them. Trouble with semiconductors may lead to personal injury, fire or property dama ge. Remember to give due consideration to safety when making your circuit desi gns, with appropriate measures such as (i) placement of substitutive, auxiliar y circuits, (ii) use of nonflammable ma terial or (iii) prevention against any malfunction or mis.


Renesas H8S2673

hap. Notes regarding these materials 1. These materials are intended as a refe rence to assist our customers in the se lection of the Renesas Technology Corp. product best suited to the customer's application; they do not convey any lic ense under any intellectual property ri ghts, or any other rights, belonging to Renesas Technology Corp. or a third pa rty. 2. Renesas Te.

Part

H8S2673

Description

16-Bit Single-Chip Microcomputer



Feature


REJ09B0283-0300 The revision list can be viewed directly by clicking the title page. The revision list summarizes the locations of revisions and additions. D etails should always be checked by refe rring to the relevant text. 16 H8S/26 78 Group, H8S/2678R Group, H8S/2676 F-Z TAT Hardware Manual Renesas 16-Bit S ingle-Chip Microcomputer H8S Family/H8S /2600 Series H8S/267.
Manufacture

Renesas

Datasheet
Download H8S2673 Datasheet




 H8S2673
REJ09B0283-0300
The revision list can be viewed directly by
clicking the title page.
The revision list summarizes the locations of
revisions and additions. Details should always
be checked by referring to the relevant text.
16
H8S/2678 Group, H8S/2678R Group,
H8S/2676 F-ZTAT
Hardware Manual
Renesas 16-Bit Single-Chip Microcomputer
H8S Family/H8S/2600 Series
H8S/2676
H8S/2675
H8S/2674R
H8S/2673
H8S/2670
HD64F2676
HD6432676
HD6432675
HD6412674R
HD6432673
HD6412670
Rev. 3.00
Revision Date: Mar 17, 2006
Free Datasheet http://www.datasheet4u.com/




 H8S2673
Keep safety first in your circuit designs!
1. Renesas Technology Corp. puts the maximum effort into making semiconductor products better and
more reliable, but there is always the possibility that trouble may occur with them. Trouble with
semiconductors may lead to personal injury, fire or property damage.
Remember to give due consideration to safety when making your circuit designs, with appropriate
measures such as (i) placement of substitutive, auxiliary circuits, (ii) use of nonflammable material or
(iii) prevention against any malfunction or mishap.
Notes regarding these materials
1. These materials are intended as a reference to assist our customers in the selection of the Renesas
Technology Corp. product best suited to the customer's application; they do not convey any license
under any intellectual property rights, or any other rights, belonging to Renesas Technology Corp. or
a third party.
2. Renesas Technology Corp. assumes no responsibility for any damage, or infringement of any third-
party's rights, originating in the use of any product data, diagrams, charts, programs, algorithms, or
circuit application examples contained in these materials.
3. All information contained in these materials, including product data, diagrams, charts, programs and
algorithms represents information on products at the time of publication of these materials, and are
subject to change by Renesas Technology Corp. without notice due to product improvements or
other reasons. It is therefore recommended that customers contact Renesas Technology Corp. or
an authorized Renesas Technology Corp. product distributor for the latest product information
before purchasing a product listed herein.
The information described here may contain technical inaccuracies or typographical errors.
Renesas Technology Corp. assumes no responsibility for any damage, liability, or other loss rising
from these inaccuracies or errors.
Please also pay attention to information published by Renesas Technology Corp. by various means,
including the Renesas Technology Corp. Semiconductor home page (http://www.renesas.com).
4. When using any or all of the information contained in these materials, including product data,
diagrams, charts, programs, and algorithms, please be sure to evaluate all information as a total
system before making a final decision on the applicability of the information and products. Renesas
Technology Corp. assumes no responsibility for any damage, liability or other loss resulting from the
information contained herein.
5. Renesas Technology Corp. semiconductors are not designed or manufactured for use in a device or
system that is used under circumstances in which human life is potentially at stake. Please contact
Renesas Technology Corp. or an authorized Renesas Technology Corp. product distributor when
considering the use of a product contained herein for any specific purposes, such as apparatus or
systems for transportation, vehicular, medical, aerospace, nuclear, or undersea repeater use.
6. The prior written approval of Renesas Technology Corp. is necessary to reprint or reproduce in
whole or in part these materials.
7. If these products or technologies are subject to the Japanese export control restrictions, they must
be exported under a license from the Japanese government and cannot be imported into a country
other than the approved destination.
Any diversion or reexport contrary to the export control laws and regulations of Japan and/or the
country of destination is prohibited.
8. Please contact Renesas Technology Corp. for further details on these materials or the products
contained therein.
Rev. 3.00 Mar 17, 2006 page ii of l
Free Datasheet http://www.datasheet4u.com/




 H8S2673
General Precautions on Handling of Product
1. Treatment of NC Pins
Note:
Do not connect anything to the NC pins.
The NC (not connected) pins are either not connected to any of the internal circuitry or are
used as test pins or to reduce noise. If something is connected to the NC pins, the
operation of the LSI is not guaranteed.
2. Treatment of Unused Input Pins
Note:
Fix all unused input pins to high or low level.
Generally, the input pins of CMOS products are high-impedance input pins. If unused pins
are in their open states, intermediate levels are induced by noise in the vicinity, a pass-
through current flows internally, and a malfunction may occur.
3. Processing before Initialization
Note: When power is first supplied, the product’s state is undefined.
The states of internal circuits are undefined until full power is supplied throughout the
chip and a low level is input on the reset pin. During the period where the states are
undefined, the register settings and the output state of each pin are also undefined. Design
your system so that it does not malfunction because of processing while it is in this
undefined state. For those products which have a reset function, reset the LSI immediately
after the power supply has been turned on.
4. Prohibition of Access to Undefined or Reserved Addresses
Note: Access to undefined or reserved addresses is prohibited.
The undefined or reserved addresses may be used to expand functions, or test registers
may have been be allocated to these addresses. Do not access these registers; the system’s
operation is not guaranteed if they are accessed.
Rev. 3.00 Mar 17, 2006 page iii of l
Free Datasheet http://www.datasheet4u.com/






Recommended third-party H8S2673 Datasheet






@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)