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Module 8MByte. MD2802-D08 Datasheet

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Module 8MByte. MD2802-D08 Datasheet






MD2802-D08 8MByte. Datasheet pdf. Equivalent




MD2802-D08 8MByte. Datasheet pdf. Equivalent





Part

MD2802-D08

Description

DiskOnChip Millennium Module 8MByte



Feature


Data Sheet DiskOnChip® Millennium Modu le 8MByte Highlights DiskOnChip Millenn ium Module is a member of M-Systems’ family of DiskOnChip flash disk product s. It is available in 8MByte (MB) capac ity, 32-pin DIP form factor, and replac es M-Systems’ DiskOnChip Millennium 8 MB DIP product. DiskOnChip Millennium M odule features: Single-chip, plug and p lay flash disk Low powe.
Manufacture

M-Systems

Datasheet
Download MD2802-D08 Datasheet


M-Systems MD2802-D08

MD2802-D08; r, single 3.3V or 5V power supply 8MByte capacity Simple, easy-to-integrate int erface 8KByte memory window eXecute In Place (XIP) OS boot functionality Propr ietary TrueFFS® technology for full ha rd disk emulation, high data reliabilit y and maximum flash lifetime NAND-based flash technology Software tools for pr ogramming, duplicating, testing and deb ugging Hardware Co.


M-Systems MD2802-D08

mpatibility 32-pin DIP, JEDEC standard E EPROMcompatible pinout Compatible with all major CPUs, including x86, StrongAR M, XScale, Geode® SCxxxx, PowerPC™ M PC8xx, MediaGX, 68K, MIPS, SuperH™ SH -x 8-bit, 16-bit and 32-bit bus archite cture support Compatibility with Mille nnium DIP Hardware compatibility Pinout Timing Fully software compatible (no n eed to upgrade TrueFFS).


M-Systems MD2802-D08

Same socket on the target platform can be used when migrating from DiskOnChip Millennium 8MB DIP Reliability On-the- fly Reed-Solomon Error Detection Code/E rror Correction Code (EDC/ECC) Guarante ed data integrity, even after power fai lure Transparent bad block management TrueFFS Software Full hard-disk read/wr ite emulation for transparent file syst em management Pate.

Part

MD2802-D08

Description

DiskOnChip Millennium Module 8MByte



Feature


Data Sheet DiskOnChip® Millennium Modu le 8MByte Highlights DiskOnChip Millenn ium Module is a member of M-Systems’ family of DiskOnChip flash disk product s. It is available in 8MByte (MB) capac ity, 32-pin DIP form factor, and replac es M-Systems’ DiskOnChip Millennium 8 MB DIP product. DiskOnChip Millennium M odule features: Single-chip, plug and p lay flash disk Low powe.
Manufacture

M-Systems

Datasheet
Download MD2802-D08 Datasheet




 MD2802-D08
Data Sheet
DiskOnChip® Millennium Module
8MByte
Highlights
DiskOnChip Millennium Module is a member of
M-Systems’ family of DiskOnChip flash disk
products. It is available in 8MByte (MB) capacity,
32-pin DIP form factor, and replaces M-Systems’
DiskOnChip Millennium 8MB DIP product.
DiskOnChip Millennium Module features:
Single-chip, plug and play flash disk
Low power, single 3.3V or 5V power supply
8MByte capacity
Simple, easy-to-integrate interface
8KByte memory window
eXecute In Place (XIP) OS boot functionality
Proprietary TrueFFS® technology for full hard
disk emulation, high data reliability and
maximum flash lifetime
NAND-based flash technology
Software tools for programming, duplicating,
testing and debugging
Reliability
On-the-fly Reed-Solomon Error Detection
Code/Error Correction Code (EDC/ECC)
Guaranteed data integrity, even after power
failure
Transparent bad block management
TrueFFS Software
Full hard-disk read/write emulation for
transparent file system management
Patented methods to extend flash lifetime,
including:
Dynamic virtual mapping
Dynamic and static wear leveling
Support for all major OSs, including:
VxWorks, Windows CE, Windows NT, Linux,
Nucleus and QNX
Operates with TrueFFS Software Development
Kit (SDK) in OS-less environment
Hardware Compatibility
32-pin DIP, JEDEC standard EEPROM-
compatible pinout
Compatible with all major CPUs, including x86,
StrongARM, XScale, Geode® SCxxxx,
PowerPC™ MPC8xx, MediaGX, 68K, MIPS,
SuperH™ SH-x
8-bit, 16-bit and 32-bit bus architecture support
Compatibility with Millennium DIP
Hardware compatibility
Pinout
Timing
Fully software compatible (no need to upgrade
TrueFFS)
Same socket on the target platform can be used
when migrating from DiskOnChip Millennium
8MB DIP
Applications
Embedded systems
Internet access devices
Internet set-top boxes, interactive TVs,
web browsers
WBT, thin clients, network computers
Routers, switches, networking equipment
Web phones, Car PCs, DVD, HPC
Automotive computing
Point of sale (POS) terminals, industrial PCs
Medical equipment
1
Data Sheet, Rev. 1.1
93-SR-008-01-8L
Free Datasheet http://www.datasheet4u.net/




 MD2802-D08
DiskOnChip Millennium Module 8MByte
Table of Contents
1. Introduction ......................................................................................................................... 4
2. Product Overview ................................................................................................................ 5
2.1 Product Description ...................................................................................................................... 5
2.2 Pin Assignment............................................................................................................................. 6
2.3 System Interface........................................................................................................................... 6
2.4 Signal Descriptions ....................................................................................................................... 7
3. Theory of Operation ............................................................................................................ 8
3.1 Major Functional Blocks ............................................................................................................... 8
3.1.1 System Interface ....................................................................................................................... 8
3.1.2 Boot Block with eXecute In Place (XIP) Capability ................................................................... 9
3.1.3 Error Detection Code/Error Correction Code (EDC/ECC) ........................................................ 9
3.1.4 Flash Control............................................................................................................................. 9
3.2 Modes of Operation ...................................................................................................................... 9
3.3 8KB Memory Window ................................................................................................................. 10
4. TrueFFS Technology......................................................................................................... 11
4.1 General Description .................................................................................................................... 11
4.2 Built-in Operating System Support ............................................................................................. 11
4.3 TrueFFS Software Development Kit (SDK) ................................................................................ 12
4.4 File Management ........................................................................................................................ 12
4.5 Bad Block Management ............................................................................................................. 12
4.6 Wear-Leveling............................................................................................................................. 12
4.6.1 Dynamic Wear-Leveling.......................................................................................................... 12
4.6.2 Static Wear-Leveling ............................................................................................................... 13
4.7 Power Failure Management ....................................................................................................... 13
4.8 Error Detection/Correction .......................................................................................................... 13
4.9 Special Features through I/O Control (IOCTL) Mechanism ....................................................... 13
4.10 Compatibility ............................................................................................................................... 13
5. Boot Procedure in PC-Compatible Platforms ................................................................. 14
6. Design Considerations ..................................................................................................... 15
6.1 Design Environment ................................................................................................................... 15
6.2 System Interface......................................................................................................................... 16
6.2.1 Standard Interface................................................................................................................... 16
6.2.2 Signal Connections ................................................................................................................. 16
6.3 Platform-Specific Issues ............................................................................................................. 17
6.3.1 Wait State................................................................................................................................ 17
6.3.2 Big and Little Endian Systems ................................................................................................ 17
6.3.3 Working with 8/16/32-Bit Systems .......................................................................................... 17
6.4 Compatibility with DiskOnChip Millennium DIP 8MB.................................................................. 17
2
Data Sheet, Rev. 1.1
93-SR-008-01-8L
Free Datasheet http://www.datasheet4u.net/




 MD2802-D08
DiskOnChip Millennium Module 8MByte
7. Product Specifications ..................................................................................................... 18
7.1 Environmental Specifications ..................................................................................................... 18
7.1.1 Operating Temperature Ranges ............................................................................................. 18
7.1.2 DiskOnChip Assembly ............................................................................................................ 18
7.1.3 Humidity .................................................................................................................................. 18
7.1.4 Shock and Vibration ................................................................................................................ 18
7.2 Endurance .................................................................................................................................. 18
7.3 Disk Capacity.............................................................................................................................. 18
7.4 Electrical Specifications .............................................................................................................. 19
7.4.1 Absolute Maximum Ratings .................................................................................................... 19
7.4.2 Capacitance ............................................................................................................................ 19
7.4.3 DC Electrical Characteristics Over Operating Range ............................................................. 19
7.4.4 AC Operating Conditions ........................................................................................................ 20
7.5 Timing Specifications.................................................................................................................. 21
7.5.1 Read Cycle Timing.................................................................................................................. 21
7.5.2 Write Cycle Timing Standard Interface ................................................................................... 22
7.5.3 Power-Up Timing .................................................................................................................... 23
7.6 Mechanical Dimensions.............................................................................................................. 24
8. Ordering Information......................................................................................................... 25
3
Data Sheet, Rev. 1.1
93-SR-008-01-8L
Free Datasheet http://www.datasheet4u.net/






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