Ultra fast recovery type
Chip Silicon Rectifier
HFM101-M THRU HFM107-M
Ultra fast recovery type
Formosa MS
SOD-123
0.161(4.1) 0.146(3.7) 0.012(...
Description
Chip Silicon Rectifier
HFM101-M THRU HFM107-M
Ultra fast recovery type
Formosa MS
SOD-123
0.161(4.1) 0.146(3.7) 0.012(0.3) Typ.
Features
Plastic package has Underwriters Laboratory Flammability Classification 94V-O Utilizing Flame Retardant Epoxy Molding Compound. For surface mounted applications. Exceeds environmental standards of MIL-S-19500 / 228 Low leakage current.
0.063(1.6) 0.055(1.4)
0.071(1.8) 0.055(1.4)
0.110(2.8) 0.094(2.4)
Mechanical data
Case : Molded plastic, JEDEC SOD-123 / MINI SMA Terminals : Solder plated, solderable per MIL-STD-750, Method 2026 Polarity : Indicated by c athode band Mounting P osition : Any Weight : 0.04 gram
0.035(0.9) Typ.
0.035(0.9) Typ.
Dimensions in inches and (millimeters)
MAXIMUM RATINGS (AT TA=25oC unless otherwise noted)
PARAMETER Forward rectified current Forward surge current CONDITIONS Ambient temperature = 50 C 8.3ms single half sine-wave superimposed on rate load (JEDEC methode) VR = VRRM TA = 25o C
o
Symbol IO IFSM
MIN.
TYP.
MAX. 1.0 30 5.0 150
UNIT A A uA uA
o
Reverse current Thermal resistance Diode junction capacitance Storage temperature
VR = VRRM TA = 100o C Junction to ambient f=1MHz and applied 4vDC reverse voltage
IR Rq JA CJ TSTG -55 42 20
C / w pF
+150
o
C
SYMBOLS
MARKING CODE H1 H2 H3 H4 H5 H6 H7
V RRM
(V)
*1
V RMS
(V) 35 70 140 210 280 420 560
*2
VR
*3
VF
*4
T RR
*5
Operating temperature ( o C)
(V) 50 100 200 300 400 600 800
(V)
(nS)
HFM101-M HFM102-M HFM103-M HFM104-M HFM105-...
Similar Datasheet