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IP4264CZ8-40-TTL Dataheets PDF



Part Number IP4264CZ8-40-TTL
Manufacturers NXP
Logo NXP
Description (IP4264CZ8-10/-20/-40-TTL) Integrated (U)SIM card passive filter array
Datasheet IP4264CZ8-40-TTL DatasheetIP4264CZ8-40-TTL Datasheet (PDF)

IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Rev. 2 — 12 October 2011 Product data sheet 1. Product profile 1.1 General description The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up .

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IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection Rev. 2 — 12 October 2011 Product data sheet 1. Product profile 1.1 General description The IP4264CZ8-10-TTL, IP4264CZ8-20-TTL and IP4264CZ8-40-TTL are 3-channel RC low-pass filter arrays. They are designed to provide filtering of undesired RF signals in the 800 MHz-to-3000 MHz frequency band. They incorporate diodes to provide protection to downstream components from ElectroStatic Discharge (ESD) voltages up to 25 kV contact and higher than 25 kV air discharge, far exceeding IEC 61000-4-2, level 4. The devices support ESD protection of the USB data pins of a Universal Subscriber Identity Module (USIM) interface, as well as the digital standard SIM interface ESD protection and ElectroMagnetic Interface (EMI) filtering. The devices are fabricated using monolithic silicon technology. They integrate three resistors and eight high-level ESD protection diodes in a 0.4 mm pitch Quad Flat-pack No-leads (QFN) plastic package with a height of only 0.5 mm. These features make all three devices ideal for use in applications requiring component miniaturization, such as mobile phone handsets, cordless telephones and personal digital devices. Similar products are available in Wafer Level Chip-Size Package (WLCSP). IP4365CX11/P (0.4 mm pitch, 11-ball WLCSP11) is designed for USIM interfaces. IP4364CX8 (0.4 mm pitch, 8-ball WLCSP8) and IP4064CX8 (0.5 mm pitch, 8-ball WLCSP8) are designed for SIM interfaces. 1.2 Features and benefits  Pb-free, Restriction of Hazardous Substances (RoHS) compliant and free of halogen and antimony (Dark Green compliant)  3-channel SIM card interface integrated RC-filter array and SIM voltage ESD protection  2 USIM (USB 1.1) compliant ESD protection diodes with 20 pF channel capacitance  Integrated 100 /100 /47  series channel resistors  Total channel capacitance of 10 pF (IP4264CZ8-10-TTL), 20 pF (IP4264CZ8-20-TTL) or 40 pF (IP4264CZ8-40-TTL)  Downstream ESD protection up to 25 kV (contact) according to IEC 61000-4-2  Micropak (QFN compatible) plastic package with 0.4 mm pitch 1.3 Applications  SIM interfaces in for example, cellular phone and Personal Communication System (PCS) mobile handsets Free Datasheet http://www.datasheet4u.net/ NXP Semiconductors IP4264CZ8-10/20/40-TTL Integrated (U)SIM card passive filter array with ESD protection 2. Pinning information Table 1. Pin 1 and 8 2 and 7 3 and 6 4 and 5 GND Pinning Description filter channel 1 filter channel 2 filter channel 3 ESD protection ground 1 4 Transparent top view 2 47 Ω R3 Simplified outline 8 5 Graphic symbol R1 1 100 Ω R2 8 7 3 100 Ω 6 5 4 018aaa015 3. Ordering information Table 2. Ordering information Package Name IP4264CZ8-10-TTL IP4264CZ8-20-TTL IP4264CZ8-40-TTL HUSON8 Description plastic thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35  1.7  0.55 mm Version SOT1166-1 Type number 4. Marking Table 3. Marking.


IP4264CZ8-20-TTL IP4264CZ8-40-TTL IRLD014


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