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MCIMX357CJQ5C Dataheets PDF



Part Number MCIMX357CJQ5C
Manufacturers Freescale Semiconductor
Logo Freescale Semiconductor
Description i.MX35 Applications Processors
Datasheet MCIMX357CJQ5C DatasheetMCIMX357CJQ5C Datasheet (PDF)

Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11 products with the right performance and integration to address a.

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Document
Freescale Semiconductor Data Sheet: Technical Data Document Number: MCIMX35SR2CEC Rev. 10, 06/2012 IMX35 i.MX35 Applications Processors for Industrial and Consumer Products 1 Introduction Package Information Plastic Package Case 5284 17 x 17 mm, 0.8 mm Pitch Ordering Information See Table 1 on page 3 for ordering information. The i.MX353 and the i.MX357 multimedia applications processors represent the next generation of ARM11 products with the right performance and integration to address applications within the industrial and consumer markets for applications such as HMI and display controllers. Unless otherwise specified, the material in this data sheet is applicable to both the i.MX353 and i.MX357 devices and referred to singularly throughout this document as i.MX35 or MCIMX35. The i.MX353 devices do not include a graphics processing unit (GPU). For information on i.MX35 devices for automotive applications, please refer to document number, MCIMX35SR2AEC. The i.MX35 processor takes advantage of the ARM1136JF-S™ core running at 532 MHz that is boosted by a multi-level cache system and integrated features such as LCD controller, Ethernet, and graphics acceleration for creating rich user interfaces. The i.MX35 supports connections to various types of external memories, such as SDRAM, mobile DDR, and DDR2, SLC and MCL NAND Flash, NOR Flash and 1. Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1. Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 1.2 Ordering Information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.3. Block Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Functional Description and Application Information. . . . . . 4 2.1. Application Processor Domain Overview . . . . . . . . . 5 2.2. Shared Domain Overview . . . . . . . . . . . . . . . . . . . . 6 2.3. Advanced Power Management Overview . . . . . . . . 6 2.4. ARM11 Microprocessor Core. . . . . . . . . . . . . . . . . . 6 2.5. Module Inventory . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 3. Signal Descriptions: Special Function Related Pins . . . . 12 4. Electrical Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 12 4.1. i.MX35 Chip-Level Conditions . . . . . . . . . . . . . . . . 12 4.2. Power Modes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 4.3. Supply Power-Up/Power-Down Requirements and Restrictions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4.4. Reset Timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 4.5. Power Characteristics . . . . . . . . . . . . . . . . . . . . . . 18 4.6. Thermal Characteristics . . . . . . . . . . . . . . . . . . . . . 19 4.7. I/O Pin DC Electrical Characteristics . . . . . . . . . . . 20 4.8. I/O Pin AC Electrical Characteristics . . . . . . . . . . . 23 4.9. Module-Level AC Electrical Specifications . . . . . . . 29 5. Package Information and Pinout . . . . . . . . . . . . . . . . . . 130 5.1. MAPBGA Production Package 1568-01, 17 × 17 mm, 0.8 Pitch . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 131 5.2. MAPBGA Signal Assignments . . . . . . . . . . . . . . . 132 6. Product Documentation . . . . . . . . . . . . . . . . . . . . . . . . . 144 7. Revision History. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 145 © Freescale Semiconductor, Inc., 2010. All rights reserved. Free Datasheet http://www.Datasheet4U.com SRAM. The devices can be connected to a variety of external devices such as USB 2.0 OTG, ATA, MMC/SDIO, and Compact Flash. 1.1 Features It provides low-power solutions for applications demanding high-performance multimedia and graphics. The i.MX35 is based on the ARM1136 platform, which has the following features: • ARM1136JF-S processor, version r1p3 • 16-Kbyte L1 instruction cache • 16-Kbyte L1 data cache • 128-Kbyte L2 cache, version r0p4 • 128 Kbytes of internal SRAM • Vector floating point unit (VFP11) To boost multimedia performance, the following hardware accelerators are integrated: • Image processing unit (IPU) • OpenVG 1.1 graphics processing unit (GPU) (not available for the MCIMX351) The MCIMX35 provides the following interfaces to external devices (some of these interfaces are muxed and not available simultaneously): • 2 controller area network (CAN) interfaces • 2 SDIO/MMC interfaces, 1 SDIO/CE-ATA interface (CE-ATA is not available for the MCIMX351) • 32-bit mobile DDR, DDR2 (4-bank architecture), and SDRAM (up to 133 MHz) • 2 configurable serial peripheral interfaces (CSPI) (up to 52 Mbps each) • Enhanced serial audio interface (ESAI) • 2 synchronous serial interfaces (SSI) • Ethernet MAC 10/100 Mbps • 1 USB 2.0 host with ULPI interface or internal full-speed PHY. Up to 480 Mbps if external HS PHY is used. • 1 USB 2.0 OTG (up to 480 Mbps) controller with internal high-speed OTG PHY • Flash controller—MLC/SLC NAND and NOR • GPIO with interrupt capabilities • 3 I2C modules.


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