LQFP44

Philips Semiconductors PC board footprint Footprint information for reflow soldering of LQFP44 package SOT389-1 Hx Gx P2 P1 (0.125) Hy Gy By Ay C D2 (8×) Bx Ax Generic footprint pattern D1 Refer to the package outline drawing for actual layout solder land occupied area DIMENSIONS in mm P1 0.800 P2 Ax Ay Bx By C 1.500 D1 0.500 D2 0.600 Gx Gy Hx Hy 0.850 13.300 13.300 10.300 10.300 10.500 10.500 13.550 13.550 SOT389-1_fp_reflow © Koninklijke Philips Electronics N.V. 2004. All rights reserved. PDF 29 December 2004 1 of 1 Free Datasheet http://www.Datasheet4U.com ...