Package Outline
P/PG-LQFP-64-4, -5, -13
Package Outline
1.6 MAX.
1.4 ±0.05
0.1 ±0.05
0.15 -0.06
+0.05
+0.07
H 0.6 ±0.15 0.2 -0.03...
Description
P/PG-LQFP-64-4, -5, -13
Package Outline
1.6 MAX.
1.4 ±0.05
0.1 ±0.05
0.15 -0.06
+0.05
+0.07
H 0.6 ±0.15 0.2 -0.03
0.5 7.5 C 0.08 C 64x
0.08 M A-B D C 64x
12 10
1)
0.2 A-B D 64x 0.2 A-B D H 4x
D A
64
B
10
1)
Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side
1
Foot Print
Soldering Type: Reflow Soldering
0.5
12
1.35
11.45
0.5
0.29
0.29
11.45
Package Information
1.35
Published by Infineon Tec hnologies AG
7° MAX.
http://www.Datasheet4U.com
P/PG-LQFP-64-4, -5, -13
Marking Layout
Type code
Manufacturer
Pin 1 Marking
123456789 123456789 12345678901 XXXXXXXX XXX
Date code (YYWW) G = Green Product Mother lot number Split lot number
Tape and Reel
Reel ø330 mm: 1.900 Pieces/Reel Reels/Box: 1
Index Marking
G
16
0.3
12.35 12.35
24
1.55 2.05
Bakable Tray
Pieces/Tray: 160 Trays/Box: 1; 6
7.62
315
15.7
13
13.1 15.2
Mark for Pin 1
Package Information
Published by Infineon Technologies AG
135.9
http://www.Datasheet4U.com
...
Similar Datasheet