PG-LQFP-64-4

P/PG-LQFP-64-4, -5, -13 Package Outline 1.6 MAX. 1.4 ±0.05 0.1 ±0.05 0.15 -0.06 +0.05 +0.07 H 0.6 ±0.15 0.2 -0.03 0.5 7.5 C 0.08 C 64x 0.08 M A-B D C 64x 12 10 1) 0.2 A-B D 64x 0.2 A-B D H 4x D A 64 B 10 1) Index Marking 1) Does not include plastic or metal protrusion of 0.25 max. per side 1 Foot Print Soldering Type: Reflow Soldering 0.5 12 1.35 11.45 0.5 0.29 0.29 11.45 Package Information 1.35 Published by Infineon Tec hnologies AG 7° MAX. http://www.Datasheet4U.com P/PG-LQFP-64-4, -5, -13 Marking Layout Type code Manufacturer Pin 1 Marking 123456789 123456789 12345678901 XXXXXXXX XXX Date code (YYWW) G = Green Product Mother lot number Split lot number Tape and Reel Reel ø330 mm: 1.900 Pieces/Reel Reels/Box: 1 Index Marking G 16 0.3 12.35 12.35 24 1.55 2.05 Bakable Tray Pieces/Tray: 160 Trays/Box: 1; 6 7.62 315 15.7 13 13.1 15.2 Mark for Pin 1 Package Information Published by Infineon Technologies AG 135.9 http://www.Datasheet4U.com ...